Tungsten Through-Si Via (TSV) Technology for Three-Dimensional LSIs

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概要

• 論文の詳細を見る
• 2007-09-19

著者

• 小柳 光正

  東北大院工

• FUKUSHIMA Takafumi

  Dept. Bioengineering and Robotics, Tohoku University

• TANAKA Tetsu

  Dept. Bioengineering and Robotics, Tohoku University

• KOYANAGI Mitsumasa

  Dept. Bioengineering and Robotics, Tohoku University

• Yamada Yusuke

  Dept. Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University

• Ali Atif

  Dept. Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University

• Koyanagi Mitsumasa

  Cir Tohoku University

• Fukushima Takafumi

  Dept. Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University

• Tanaka Tetsu

  Dept. Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University

• KIKUCHI Hirokazu

  Dept. of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University

• LIANG Jun

  Dept. of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University

• Koyanagi Mitsumasa

  Dept. Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University

• Tanaka Tetsu

  Graduate School Of Biomedical Engineering Tohoku University

• Kamiyanagi Masashi

  Center For Interdisciplinary Research Tohoku University

• Fukushima Takafumi

  Department Of Bioengineering And Robotics Tohoku University

• Kikuchi Hirokazu

  Dept. Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University

• Liang Jun

  Dept. Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University

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