Fukushima Takafumi | Department Of Advanced Materials Chemistry Graduate School Of Engineering Yokohama National Universi

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概要

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著作論文

Fabrication and Evaluation of Magnetic Tunnel Junction with MgO Tunneling Barrier
Characteristics of Metal Gate GOI-MOSFET with High-k Gate Dielectric Fabricated by Ge Condensation Method
New Reconfigurable Memory Architecture for Parallel Image Processing LSI with Three-Dimensional Structure
Development of Si Long Microprobe (SiLM) for Platform of Intelligent Neural Implant Microsystem
Low Power Spin-Transfer MRAM Writing Scheme with Selective Word Line Bootstrap
Low Power and High Sensitivity MRAM Sensing Scheme with Body Biased Preamplifier
Estimation of Wire Length Distribution for Evaluating Performance Improvement of Three-Dimensional LSI
New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration
Nickel Germanide Formation on Condensed Ge Layer for Ge-on-Insulator Device Application
Electrical Characterization of Metal–Oxide–Semiconductor Memory Devices with High-Density Self-Assembled Tungsten Nanodots
Characteristics of Copper Spiral Inductors Utilizing FePt Nanodot Films
Ultrafast Active Transmission Lines with Low-k Polyimide Integrated with Ultrafast Photoconductive Switches
Power Supply System Using Electromagnetic Induction for Three-Dimensionally Stacked Retinal Prosthesis Chip
Evaluation of Platinum-Black Stimulus Electrode Array for Electrical Stimulation of Retinal Cells in Retinal Prosthesis System
Evaluation of Electrical Stimulus Current Applied to Retina Cells for Retinal Prosthesis
Optical Interposer Technology using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection
Development of Si Double-Sided Microelectrode for Platform of Brain Signal Processing System
Development of Si Neural Probe with Microfluidic Channel Fabricated Using Wafer Direct Bonding
Characteristics of Silicon-on-Low $k$ Insulator Metal Oxide Semiconductor Field Effect Transistor with Metal Back Gate
New Reconfigurable Memory Architecture for Parallel Image-Processing LSI with Three-Dimensional Structure
Nickel Germanide Formation on Condensed Ge Layer for Ge-on-Insulator Device Application
Fundamental Study of Complementary Metal Oxide Semiconductor Image Sensor for Three-Dimensional Image Processing System
Tungsten Through-Silicon Via Technology for Three-Dimensional LSIs
Effects of Ion Implantation Damage on Elevated Source/Drain Formation for Ultrathin Body Silicon on Insulator Metal Oxide Semiconductor Field-Effect Transistor
Fabrication and Evaluation of Magnetic Tunnel Junction with MgO Tunneling Barrier
New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super-Chip Integration
Quantitative Derivation and Evaluation of Wire Length Distribution in Three-Dimensional Integrated Circuits Using Simulated Quenching
Low Power Spin-Transfer Magnetoresistive Random Access Memory Writing Scheme with Selective Word Line Bootstrap
Novel Optical/Electrical Printed Circuit Board with Polynorbornene Optical Waveguide
Low-Power and High-Sensitivity Magnetoresistive Random Access Memory Sensing Scheme with Body-Biased Preamplifier
New Magnetic Flash Memory with FePt Magnetic Floating Gate
New Magnetic Nanodot Memory with FePt Nanodots
Three-Dimensionally Stacked Analog Retinal Prosthesis Chip
Low-Loss Optical Interposer with Recessed Vertical-Cavity Surface-Emitting Laser Diode and Photodiode Chips into Si Substrate
Deep-Trench Etching for Chip-to-Chip Three-Dimensional Integration Technology
Multichip Shared Memory Module with Optical Interconnection for Parallel-Processor System
Ultrafast Active Transmission Lines with Low-$k$ Polyimide Integrated with Ultrafast Photoconductive Switches

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