Optical Interposer Technology using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection
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概要
- 論文の詳細を見る
A novel optical interposer with optical interconnections is proposed for integrating three-dimensional (3D) LSI chips on this interposer. Vertical-cavity surface-emitting laser diode (VCSEL) chips and photo diode (PD) chips are buried in the optical interposer with polymeric optical waveguides. The VCSEL is 0.25 mm in width, 0.35 mm in length, and 0.15 mm in height. We realize precise passive alignment between the optical waveguides and the VCSEL/PD chips using two-step alignment processes consisting of cavity-assisted positioning and the subsequent surface-tension-powered self-assembly with a molten solder. In addition, we demonstrate the basic operation of the buried VCSEL chips in the optical interposer through tapered through-silicon vias (TSVs). The tapered TSVs are successfully formed by copper electroplating and are 64 μm in top width, 34 μm in bottom width, and 168 μm in length.
- 2009-04-25
著者
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Lee Kang-wook
Department Of Internal Medicine College Of Medicine Chungnam National University
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Fukushima Takafumi
Department Of Advanced Materials Chemistry Graduate School Of Engineering Yokohama National Universi
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Tanaka Tetsu
Department Of Quantum Materials Science University Of Tokushima
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Koyanagi Mitsumasa
Department Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University
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Jeong Woo-Cheol
Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University, 6-6-01 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
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Fujiwara Makoto
Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University, 6-6-01 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
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Noriki Akihiro
Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University, 6-6-01 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
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Fukushima Takafumi
Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University, 6-6-01 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
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Lee Kang-Wook
Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University, 6-6-01 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
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Tanaka Tetsu
Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University, 6-6-01 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
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