Progress of Three-Dimensional Integration Technology
スポンサーリンク
概要
- 論文の詳細を見る
- 2000-08-28
著者
-
Koyanagi Mitsumasa
Department Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University
-
Koyanagi Mitsumasa
Department Of Machine Intelligence And Systems Engineering Graduate School Of Engineering Tohoku Uni
関連論文
- Development of Three-Dimensional Integration Technology for Highly Parallel Image-Processing Chip
- A New Wafer Scale Chip-on-Chip (W-COC) Packaging Technology Using Adhesive Injection Method
- New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method
- Fabrication and Evaluation of Magnetic Tunnel Junction with MgO Tunneling Barrier
- Characteristics of Metal Gate GOI-MOSFET with High-k Gate Dielectric Fabricated by Ge Condensation Method
- Polyimide Optical Waveguide with Multi-Fan-Out for Multi-Chip Module Application
- Fabrication of Hollow Cylinder Shape Permalloy on the Si Pole
- Ultrashallow Junction Formation by Rapid Thermal Annealing of Arsenic-Adsorbed Layer
- New Reconfigurable Memory Architecture for Parallel Image Processing LSI with Three-Dimensional Structure
- Development of Si Long Microprobe (SiLM) for Platform of Intelligent Neural Implant Microsystem
- Low Power Spin-Transfer MRAM Writing Scheme with Selective Word Line Bootstrap
- Low Power and High Sensitivity MRAM Sensing Scheme with Body Biased Preamplifier
- Estimation of Wire Length Distribution for Evaluating Performance Improvement of Three-Dimensional LSI
- QUANTITATIVE PCR-BASED SCREENING OF THE CO_2 SENSOR PROTEIN OF THE MOSQUITO (ANOPHELES STEPHENSI)(Physiology,Abstracts of papers presented at the 76^ Annual Meeting of the Zoological Society of Japan)
- CO_2 SENSOR PROTEIN IN THE MOSQUITO (ANOPHELES STEPHENSI)(Physiology,Abstracts of papers presented at the 75^ Annual Meeting of the Zoological Society of Japan)
- IDENTIFICATION AND CHARACTERIZATION OF ENCEPHALOPSIN HOMOLOGUES OF THE MOSQUITO AND THE HONEYBEE(Physiology,Abstracts of papers presented at the 76^ Annual Meeting of the Zoological Society of Japan)
- Retinal Prosthesis System with Telemetry Circuit Controlled by Human Eyelid Movement
- Design and Evaluation of a High Speed Routing Lookup Architecture(Implementation and Operation)(Internet Technology IV)
- New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration
- THE NEURAL NETWORK RELATED WITH THE CHROMATIC TYPE RESPONSE OF THE LAMPREY PINEAL(Physiology,Abstracts of papers presented at the 75^ Annual Meeting of the Zoological Society of Japan)
- CHARACTERIZATION OF UV SENSITIVE OPSIN IN THE PINEAL ORGAN OF THE LAMPREY(Physiology,Abstracts of papers presented at the 74^ Annual Meeting of the Zoological Society of Japan)
- UV-SENSITIVE PHOTORECEPTORS IN THE PINEAL ORGAN OF THE RIVER LAMPREY, LAMPETRA JAPONICA(Physiology,Abstracts of papers presented at the 74^ Annual Meeting of the Zoological Society of Japan)
- VISUAL PIGMENTS IN TWO PATHWAYS OF PHOTO-SIGNALS IN THE LAMPREY PINEAL ORGAN(Physiology,Abstracts of papers presented at the 74^ Annual Meeting of the Zoological Society of Japan)
- IDENTIFICATION AND CHARACTERIZATION OF VISUAL PIGMENTS OF THE JUMPING SPIDER(Physiology,Abstracts of papers presented at the 76^ Annual Meeting of the Zoological Society of Japan)
- Two-Dimensional Analytical Subthreshold Model and Optimal Scaling of Fully-Depleted SOI MOSFET Down to 0.1 μm Channel Length
- Multilevel Charge Storage in a Multiple Alloy Nanodot Memory
- Nickel Germanide Formation on Condensed Ge Layer for Ge-on-Insulator Device Application
- Electrical Characterization of Metal–Oxide–Semiconductor Memory Devices with High-Density Self-Assembled Tungsten Nanodots
- Characteristics of Copper Spiral Inductors Utilizing FePt Nanodot Films
- A Reliable Nonvolatile Memory Using Alloy Nanodot Layer with Extremely High Density
- Characteristics of a Multiple Alloy Nanodot Memory with an Enhanced Charge Storage Capability
- New Analytical Model for Subthreshold Current in Short-Channel Fully-Depleted SOI MOSFETs
- New Electrically Thinned Intrinsic-Channel SOI MOSFET with 0.01 μm Channel Length
- COUNTERION SWITCHING IN THE DIVERGENCE OF RHODOPSINS(Physiology,Abstracts of papers presented at the 74^ Annual Meeting of the Zoological Society of Japan)
- COMPARATIVE ANALYSIS ON COUNTERIONS OF VARIOUS RHODOPSINS BY USING OF THEIR MUTANT PROTEINS(Physiology)(Proceedings of the Seventy-Third Annual Meeting of the Zoological Society of Japan)
- Power Supply System Using Electromagnetic Induction for Three-Dimensionally Stacked Retinal Prosthesis Chip
- Evaluation of Platinum-Black Stimulus Electrode Array for Electrical Stimulation of Retinal Cells in Retinal Prosthesis System
- Evaluation of Electrical Stimulus Current Applied to Retina Cells for Retinal Prosthesis
- Dominance of Cl^+_2 or Cl^+ Ions in Time-Modulated Inductively Coupled Cl_2 Plasma Investigated with Laser-Induced Fluorescence Technique and Probe Measurements
- Fundamental Properties of Organic Low-$k$ Dielectrics Usable in the Cu Damascene Process
- Optical Interposer Technology using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection
- Detection of Metastable Chlorine Ions in Time-Modulated Plasma by Time Resolved Laser-Induced Fluorescence
- Proposal of New Nonvolatile Memory with Magnetic Nano-Dots
- Progress of Three-Dimensional Integration Technology
- New Analytical Model for Subthreshold Current in Short-Channel Fully-Depleted SOI MOSFETs
- Development of Si Double-Sided Microelectrode for Platform of Brain Signal Processing System
- Development of Si Neural Probe with Microfluidic Channel Fabricated Using Wafer Direct Bonding
- Characteristics of Silicon-on-Low $k$ Insulator Metal Oxide Semiconductor Field Effect Transistor with Metal Back Gate
- New Reconfigurable Memory Architecture for Parallel Image-Processing LSI with Three-Dimensional Structure
- Nickel Germanide Formation on Condensed Ge Layer for Ge-on-Insulator Device Application
- Fundamental Study of Complementary Metal Oxide Semiconductor Image Sensor for Three-Dimensional Image Processing System
- Tungsten Through-Silicon Via Technology for Three-Dimensional LSIs
- Effects of Ion Implantation Damage on Elevated Source/Drain Formation for Ultrathin Body Silicon on Insulator Metal Oxide Semiconductor Field-Effect Transistor
- New Silicon-on-Insulator (SOI) Flash Memory with Side Channel and Side Floating Gate
- Fabrication and Evaluation of Magnetic Tunnel Junction with MgO Tunneling Barrier
- New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super-Chip Integration
- Quantitative Derivation and Evaluation of Wire Length Distribution in Three-Dimensional Integrated Circuits Using Simulated Quenching
- Low Power Spin-Transfer Magnetoresistive Random Access Memory Writing Scheme with Selective Word Line Bootstrap
- Novel Optical/Electrical Printed Circuit Board with Polynorbornene Optical Waveguide
- Low-Power and High-Sensitivity Magnetoresistive Random Access Memory Sensing Scheme with Body-Biased Preamplifier
- Vision Chip with Electrical Fovea Motion
- New Magnetic Flash Memory with FePt Magnetic Floating Gate
- New Magnetic Nanodot Memory with FePt Nanodots
- Three-Dimensionally Stacked Analog Retinal Prosthesis Chip
- Low-Loss Optical Interposer with Recessed Vertical-Cavity Surface-Emitting Laser Diode and Photodiode Chips into Si Substrate
- Deep-Trench Etching for Chip-to-Chip Three-Dimensional Integration Technology
- Multichip Shared Memory Module with Optical Interconnection for Parallel-Processor System
- Novel Silicon On Insulator Metal Oxide Semiconductor Field Effect Transistors with Buried Back Gate
- CuSn/InAu μ-bump induced local deformation and mechanical stress in high-density 3D-LSI