CuSn/InAu μ-bump induced local deformation and mechanical stress in high-density 3D-LSI
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概要
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Reliability issues such as local deformation and locally induced mechanical stress in the high-density 3D-LSIs by μ-bumps were investigated using the optical interferometer and the micro-Raman spectroscopy It has been observed that the degree of local deformation in 3D-LSI increases with the increase in the bump spacing and decreases with the increase in the wafer thickness Whereas the mechanical stress due to local deformation depends not only on the wafer thickness and μ-bump layout dimensions, but also with the surface morphology of the back-ground ultra-thin wafer
- 一般社団法人電子情報通信学会の論文
- 2013-01-28
著者
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Koyanagi Mitsumasa
Department Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University
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Koyanagi Mitsumasa
Department of Biomedical Engineering, Tohoku University
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Mariappan Murugesan
New Industry Creation Hatchery Center, Tohoku University
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