Quantitative Derivation and Evaluation of Wire Length Distribution in Three-Dimensional Integrated Circuits Using Simulated Quenching

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概要

• 論文の詳細を見る

• Three-dimensional (3D) integration is the most promising technology to improve IC performance by stacking some active device layers and connecting them using vertical interconnections. In this paper, in order to quantitatively evaluate the benefits of 3D IC, wire length distributions in 3D ICs are derived by adapting the simulated quenching algorithm for 3D placement and routing of specific benchmark circuits. By evaluating the wire length distribution, we can confirm that the total wire length is reduced by 26.0 and 41.3% with three and five active layers, respectively. Similarly, 38.1 and 52.0% reduction in the longest wire length with three and five active layers can be achieved.

• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2006-04-30

著者

• Deguchi Jun

  Department Of Neurosurgery Osaka Medical College

• Sugimura Takeaki

  Department Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University

• Fukushima Takafumi

  Department Of Advanced Materials Chemistry Graduate School Of Engineering Yokohama National Universi

• Koyanagi Mitsumasa

  Department Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University

• Nakatani Yoshihiro

  Department Of Bioengineering And Robotics Tohoku University

• Deguchi Jun

  Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University, 6-6-01 Aza Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan

• Deguchi Jun

  Department of Bioengineering and Robotics, Tohoku University, 6-6-01 Aza Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan

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