Reductant-Assisted Self-Assembly with Cu/Sn Microbump for Three-Dimensional Heterogeneous Integration
スポンサーリンク
概要
- 論文の詳細を見る
To establish liquid-assisted assembly processes applicable to heterogeneous system integrations, we present flip-chip self-assembly of dies with Cu/Sn microbumps using the difference in droplet wetting between hydrophilic and hydrophobic areas. Flip-chip self-assembly is assisted by a water-soluble flux that has high surface tension comparable to that of pure water and contains an additive of a reducing agent for metal oxides. Control of the additive concentration in the flux provides high wettability contrast that enable spontaneous and precise alignment of chips to hydrophilic areas formed on substrates within 5 μm in alignment accuracy. In the subsequent chip bonding process, the reductant can eliminate the metal oxide layer and improve the solder wettability of Sn to the corresponding electrode pads formed on the chips. In addition, we confirm, through electrical characteristic evaluation after thermal compression bonding, that the resulting daisy chain formed between the substrates and self-assembled chips with the flux shows sufficiently low contact resistance of below 20 m\Omega/bump without disconnection.
- 2013-04-25
著者
-
Choki Koji
Sumitomo Bakelite Co., Ltd., Utsunomiya 321-3231, Japan
-
Fukushima Takafumi
New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai 980-8579, Japan
-
Koyanagi Mitsumasa
New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai 980-8579, Japan
-
Choki Koji
Sumitomo Bakelite Co., Ltd., 495 Akiba-cho, Totsuka-ku, Yokohama 245-0052, Japan
-
Tanaka Tetsu
Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University, 6-6-01 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
-
Ito Yuka
Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan
-
Lee Kang-Wook
New Industry Creation Hatchery Center, Tohoku University, Sendai 980-8579, Japan
-
Fukushima Takafumi
New Industry Creation Hatchery Center, Tohoku University, Sendai 980-8579, Japan
関連論文
- Trimer V^ Spin Singlet State and Pseudo Gap in LiVS_2 Studied by ^V and ^7Li Nuclear Magnetic Resonance
- New Reconfigurable Memory Architecture for Parallel Image Processing LSI with Three-Dimensional Structure
- Development of Si Long Microprobe (SiLM) for Platform of Intelligent Neural Implant Microsystem
- Low Power Spin-Transfer MRAM Writing Scheme with Selective Word Line Bootstrap
- Multilevel Charge Storage in a Multiple Alloy Nanodot Memory
- Electrical Characterization of Metal–Oxide–Semiconductor Memory Devices with High-Density Self-Assembled Tungsten Nanodots
- Characteristics of Copper Spiral Inductors Utilizing FePt Nanodot Films
- A Reliable Nonvolatile Memory Using Alloy Nanodot Layer with Extremely High Density
- Characteristics of a Multiple Alloy Nanodot Memory with an Enhanced Charge Storage Capability
- Power Supply System Using Electromagnetic Induction for Three-Dimensionally Stacked Retinal Prosthesis Chip
- Evaluation of Platinum-Black Stimulus Electrode Array for Electrical Stimulation of Retinal Cells in Retinal Prosthesis System
- Optical Interposer Technology using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection
- Development of Si Double-Sided Microelectrode for Platform of Brain Signal Processing System
- Development of Si Neural Probe with Microfluidic Channel Fabricated Using Wafer Direct Bonding
- New Reconfigurable Memory Architecture for Parallel Image-Processing LSI with Three-Dimensional Structure
- Fundamental Study of Complementary Metal Oxide Semiconductor Image Sensor for Three-Dimensional Image Processing System
- Tungsten Through-Silicon Via Technology for Three-Dimensional LSIs
- Impact of Data Transmission over 10 Gbps on High-Density and Low-Cost Optoelectronic Module with Polynorbornene Waveguides
- Low Power Spin-Transfer Magnetoresistive Random Access Memory Writing Scheme with Selective Word Line Bootstrap
- Novel Optical/Electrical Printed Circuit Board with Polynorbornene Optical Waveguide
- New Magnetic Nanodot Memory with FePt Nanodots
- Low-Loss Optical Interposer with Recessed Vertical-Cavity Surface-Emitting Laser Diode and Photodiode Chips into Si Substrate
- Investigation of Local Bending Stress Effect on Complementary Metal--Oxide--Semiconductor Characteristics in Thinned Si Chip for Chip-to-Wafer Three-Dimensional Integration
- Fabrication and In vivo Evaluation of Poly(3,4-ethylenedioxythiophene) Stimulus Electrodes for Fully Implantable Retinal Prosthesis
- Reductant-Assisted Self-Assembly with Cu/Sn Microbump for Three-Dimensional Heterogeneous Integration
- Study of Insertion Characteristics of Si Neural Probe with Sharpened Tip for Minimally Invasive Insertion to Brain (Special Issue : Solid State Devices and Materials)
- Fabrication and In vivo Evaluation of Poly(3,4-ethylenedioxythiophene) Stimulus Electrodes for Fully Implantable Retinal Prosthesis (Special Issue : Solid State Devices and Materials)