A New Inside-Type Segmented Coil Antenna for Uniformity Control in a Large-Area Inductively Coupled Plasma
スポンサーリンク
概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 2000-06-01
著者
-
HORIIKE Yasuhiro
Department of Electrical Engineering, Toyo University
-
ICHIKI Takanori
Department of Electrical & Electronics Engineering, Toyo University
-
Horiike Yasuhiro
Department Of Materials Science The University Of Tokyo
-
Horiike Yasuhiro
Department Of Electrical & Electronics Engineering Tokyo University
-
Horiike Yasuhiro
Department Of Electrical Engineering Hiroshima University
-
Chang Hong-young
Department Of Physics Korea Advanced Institute Of Science And Technology
-
Seo Sang-hun
Department Of Physics Korea Advanced Institute Of Science And Technology
-
LEE Pyung-Woo
Department of Physics, Korea Advanced Institute of Science and Technology
-
KIM Sung-Sik
Department of Physics, Korea Advanced Institute of Science and Technology
-
CHANG Choong-Seock
Department of Physics, Korea Advanced Institute of Science and Technology
-
Kim Sung-sik
Department Of Electrical And Computer Engineering Yonsei University
-
Kim Sung-sik
Department Of Physics Korea Advanced Institute Of Science And Technology
-
Lee Pyung-woo
Department Of Physics Korea Advanced Institute Of Science And Technology:hyundai Electronic Industry
-
Ichiki Takanori
Department Of Electric And Electronic Engineering Toyo University
-
Ichiki Takanori
Department Of Electrical And Electronics Engineering Toyo University
-
Horiike Yasuhiro
Department Of Materials Engineering The University Of Tokyo
-
Horiike Yasuhiro
Department Of Electrical And Electronics Engineering Toyo University:department Of Materials Science
-
Horiike Yasuhiro
Toshiba Research And Development Center Integrated Circuit Laboratory
-
Horiike Yasuhiro
Toyo University
-
Chang Choong-seock
Department Of Physics Korea Advanced Institute Of Science And Technology
-
Horiike Yasuhiro
Department Of Electrical & Electronics Engineering Toyo University
-
Ichiki Takanori
Department of Bioengineering, Graduate School of Engineering, The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan
-
Lee Pyung
Department of Physics, Korea Advanced Institute of Science and Technology
関連論文
- ナノピラー構造体が電気浸透流に及ぼす影響の評価
- 極微量全血分離・分析を目指したヘルスケアチップの創製
- Negative Ion Assisted Silicon Oxidation in Downstream of Microwave Plasma
- Measurement of Fluorocarbon Radicals Generated from C_4F_8/H_2 Inductively Coupled Plasma : Study on SiO_2 Selective Etching Kinetics
- Microloading Effect in Highty Selective Si0_2 Contact Hole Etching Employing Inductively Coupled Plasma
- Effect of Magnetic Field to Etching Characteristics of Inductively Coupled Plasma ( Plasma Processing)
- High Rate and Highly Selective SiO_2 Etching Employing Inductively Coupled Plasma
- RF Self-Bias Characteristics in Inductively Coupled Plasma
- Al Etching Characteristics Ernploying Helicon Wave Plasma
- Si Etching Employing Steady-State Magnetron Plasma with Magnet at Anode Centered in a Cylindrical Reactor
- ナノポアを通過する長鎖DNAのイメージング解析 : DNAの核膜孔通過過程のモデリングを目指して
- 18pYF-11 マイクロ・ナノチップ中における長鎖DNAのダイナミクスの解析
- カーボンナノチューブフィールドエミッターのI-V特性と先端構造
- Gap-filling of Cu Employing Sustained Self-Sputtering with Inductively Coupled Plasma Ionization
- A Model for Resolution Dependent Roughness Values Measured by an Optical Profiler for Specific Surfaces
- Enhancement of Negative-Ion-Assisted Silicon Oxidation by Radio-Frequency Bias
- Development and Plasma Characteristics Measurement of Planar-Type Magnetic Neutral Loop Discharge Etcher
- Highly Selective SiO_2/Si Etching and Related Kinetics in Time-Modulated Helicon Wave Plasma
- SiO_2 Etching Employing Inductively Coupled Plasma with Hot Inner Wall
- Mechanism of Cloudy Surface Generation on Si Wafer Employing Numerically Controlled Local Dry Etching (NC-LDE)
- In-Situ X-Ray Photoelectron Spectroscopy of Reactive-Ion-Etched Surfaces of Indium-Tin Oxide Film Employing Alcohol Gas
- Growth of Large Grained Silicon on Insulator by Electron Beam Annealing and Performance of MOS Devices : A-6: SILICON CRYSTALS
- Concentration and Injection of Long Deoxyribonucleic Acid Molecules at the Interface of Micro- and Nano-channels
- Curvature Entropy Trapping of Long DNA under Hydrodynamic Flows in Microfluidic Devices
- Fluorescence Emission Control of Long DNA Molecules Adsorbed on microelectrode Surfaces by External Voltage
- Healthcare Chip for Checking Health Condition from Analysis of Trace Blood Collected by Painless Needle
- Study on the Mechanisms of Chemical Mechanical Polishing on Copper and Aluminum Surfaces Employing In Situ Infrared Spectroscopy
- Molecular Detection in a Microfluidic Device by Streaming Current Measurements
- Translocation of a Long DNA Chain Passing Through a Nanofabricated Pore
- Study on Elemental Technologies for Creation of Healthcare Chip Fabricated on Polyethylene Terephthalate Plate
- A Study on Mechanism of Chemical Mechanical Polishing on Al and Cu Surfaces Employing In-situ Infrared Spectroscopy
- 多項目同時測定ヘルスケアチップ用マイクログルコースセンサーの創製
- Cleaning of Silicon Surfaces by NF_3-Added Hydrogen and Water-Vapor Plasma Downstream Treatment
- Heliconwave Plasma Which Contains Negative Ion
- 高齢化社会の到来とヘルスケアチップの創製 : ドライエッチング技術の展開
- Biochip Which Examines Hepatic Function by Employing Colorimetric Method
- Novel Micropaterned Surface Fabricated from Heterobifunctional Poly(ethylene glycol)/polylactide Block Copolymers for Patterned Cell Culture
- プラズマプロセスによるバイオチップの開発と展望
- 大気圧マイクロプラズマジェットの微細加工への応用
- VHF駆動によるマイクロプラズマの生成技術とマイクロ化学分析システムへの応用
- An atmospheric-pressure microplasma jet source for the optical emission spectroscopic analysis of liquid sample
- Localized and ultrahigh-rate etching of silicon wafers using atmospheric-pressure microplasma jets
- Etching Reactivity of Negative Ions Generated in Cl_2 Downstream Plasma
- Electron Energy Control in Inductively Coupled Plasma Employing Multimode Antenna
- Thin Film Detection Employing Frequency Shift in Sheath Current Oscillation
- Excitation of Sheath Oscillating Current by Superimposing Pulse Voltage
- Atomic Layer Controlled Digital Etching of Silicon : Etching and Deposition Technology
- Atomic Layer Controlled Digital Etching of Silicon
- Fabrication of Quartz Microcapillary Electrophoresis Chips Using Plasma Etching
- Gap-Filling of Cu Employing Self-Sustained Sputtering with ICP Ionization
- In-Situ Observation of Oxygen Exposed Hydrogen Terminated Silicon Surfaces
- Silicon Etching Employing Negative Ion in SF_6 Plasma
- Study on the Mechanism of Silicon Chemical Mechanical Polishing Employing In Situ Infrared Spectroscopy
- Selective Processing of Individual Carbon-Nanotubes Using Atomic Force Microscopy Installed in Transmission Electron Microscope
- A New Inside-Type Segmented Coil Antenna for Uniformity Control in a Large-Area Inductively Coupled Plasma
- Generation of Integrated Atmospheric-Pressure Microplasmas
- Localized Plasma Processing of Materials Using Atmospheric-Pressure Microplasma Jets
- Localized Removal of a Photoresist by Atmospheric Pressure Micro-plasma Jet Using RF Corona Discharge
- 容量結合型大気圧マイクロプラズマ源
- 医療
- Development of Clinical Chips for Home Medical Diagnostics
- 在宅で健康診断できるヘルスケアチップの開発 (特集 診断バイオチップの未来)
- μ-TAS応用によるバイオセンサ式ヘルスケアチップ (特集 流体MEMSのすべて--マイクロ流体デバイスの応用展開とその実用化)
- 産学独連携により2009年115WのEUV光源を実現
- 無痛針採血による在宅健康診断チップ
- 医療用バイオチップの現状と将来展望
- B-5-145 in vivoワイヤレス通信チップ用送受信回路に関する研究(B-5.無線通信システムA(移動通信))
- Conelike Defect in Deep Quartz Etching Employing Neutral Loop Discharge
- B-1-16 in vivo ワイヤレス通信チップ用アンテナに関する研究 : 電磁波の人体透過特性
- Microintaglio Printing of Biomolecules and Its Application to In situ Production of Messenger Ribonucleic Acid Display Microarray
- Numerically Controlled Dry Etching Technology for Flattening of Si Wafer which Employs SF_6/H_2 Downstream Plasma
- Si Etch Rate and Etch Yield with Ar^+/Cl_2 System
- Study on Reaction Mechanism of Aluminum Selective Chemical Vapor Deposition with In-situ XPS Measurement : Etching and Deposition Technology
- Study on Reaction Mechanism of Aluminum Selective Chemical Vapor Deposition with In-situ XPS Measurement
- Characteristics of Very High-Aspect-Ratio Contact Hole Etching
- Photoexcited Anisotropic Etching of Single-Crystalline Silicon
- High-Rate Bias Sputtering Filling of SiO2 Film Employing Both Continuous Wave and Time-Modulated Inductively Coupled Plasmas
- Miniaturized Capillary Electrophoresis Fabricated on Pyrex Glass Chips Using Deep Dry Etching and Anodic Bonding
- Localized Plasma Processing of Materials Using Atmospheric-Pressure Microplasma Jets
- Healthcare Chip for Checking Health Condition from Analysis of Trace Blood Collected by Painless Needle
- ナノ構造体を用いた無標識検出
- Downstream Etching of Si and SiO_2 Employing CF_4/O_2 or NF_3/O_2 at High Temperature : Etching and Deposition Technology
- Electromigration Characteristics of Cu-Al Precipitate in AlCu Interconnection
- Sputtering of Aluminum Film Using Microwave Plasma with High Magnetic Field
- High-Rate and Smooth Surface Etching of Al_2O_3TiC Employing Inductively Coupled Plasma (ICP)
- Gas Residence Time Effects on Plasma Parameters: Comparison between Ar and C4F8
- Capacitively Coupled Microplasma Source on a Chip at Atmospheric Pressure : Nuclear Science, Plasmas, and Electric Discharges
- Si and SiO_2 Etching under Low Self-Bias Voltage
- Digital Chemical Vapor Deposition of SiO_2 Using a Repetitive Reaction of Triethylsilane/Hydrogen and Oxidation
- A Portable Biochemical Analysis System Integrated with Microcapillary Electrophoresis and Microplasma Emission Spectroscopy
- Etching Reactivity of Negative Ions Generated in Cl2 Downstream Plasma
- Biochip Which Examines Hepatic Function by Employing Colorimetric Method
- Mechanism of Cloudy Surface Generation on Si Wafer Employing Numerically Controlled Local Dry Etching (NC-LDE)
- Initiation of the Planarization of SiO2 Film Employing Anhydrous HF Gas
- A Model for Resolution Dependent Roughness Values Measured by an Optical Profiler for Specific Surfaces
- Study on the Mechanism of Silicon Chemical Mechanical Polishing Employing In Situ Infrared Spectroscopy
- Heliconwave Plasma Which Contains Negative Ion
- Generation of Integrated Atmospheric-Pressure Microplasmas
- Study on the Mechanisms of Chemical Mechanical Polishing on Copper and Aluminum Surfaces Employing In Situ Infrared Spectroscopy
- Conelike Defect in Deep Quartz Etching Employing Neutral Loop Discharge