Electromigration Characteristics of Cu-Al Precipitate in AlCu Interconnection
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概要
- 論文の詳細を見る
The behavior of a CuAl precipitate during a direct-current stressing test in an Al-2% Cu interconnection was investigated from observations employing scanning electron microscopy and energy-dispersive X-ray microanalysis. Movement of a CuAl precipitate into the anode direction, accompanied with changes of shape and size, was frequently observed. Measurement of the drift velocity of CuAl precipitates was carried out for the first time, which revealed a value an order of magnitude less than that of solid solute Cu atoms. The obtained activation energy of 0.77 eV corresponds to Cu interface diffusion between a CuAl precipitate and Al lattice. Interaction between two adjacent CuAl precipitates was observed in such a manner that one precipitate became smaller while the other precipitate at the anode site became larger. It is considered that the Cu atoms which constituted the precipitate were transferred to the other precipitate at the anode site by solid-solute electromigration.
- 社団法人応用物理学会の論文
- 1994-07-15
著者
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堀池 靖浩
物質･材料研究機構
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新宮原 正三
Hiroshima University Graduate School Of Adsm
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SAKAUE Hiroyuki
Graduate School of Advanced Sciences of Matter, Hiroshima University
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Horiike Yasuhiro
Faculty Of Engineering Toyo University
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Horiike Yasuhiro
National Institute For Materials Science
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Horiike Yasuhiro
Department Of Electrical & Electronics Engineering Tokyo University
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Horiike Yasuhiro
Faculty Of Engineering Hiroshima University
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Horiike Yasuhiro
Department Of Electrical Engineering Toyo University
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Shingubara Shoso
Department Of Applied Physics Tokyo Institute Of Technology:vlsi Research Center Toshiba Corporation
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NISHIDA Hiroyuki
Department of Health and Physical Education, Gifu Pharmaceutical University
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Nishida H
Tokyo Denki Univ. Tokyo Jpn
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堀池 靖浩
広島大工
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Sakaue H
Hiroshima University Graduate School Of Adsm
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Sakaue Hiroyuki
Department Of Electrical Engineering Hiroshima University
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NISHIDA Hiroyuki
Deparment of Electrical Engineering, Hiroshima University
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