Highly Adhesive Electroless Cu Layer Formation Using an Ultra Thin Ionized Cluster Beam (ICB)-Pd Catalytic Layer for Sub-100 nm Cu Interconnections
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概要
- 論文の詳細を見る
- Japan Society of Applied Physicsの論文
- 2003-10-15
著者
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新宮原 正三
Hiroshima University Graduate School Of Adsm
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SAKAUE Hiroyuki
Graduate School of Advanced Sciences of Matter, Hiroshima University
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SHINGUBARA Shoso
Graduate School of Advanced Sciences of Matter, Hiroshima University
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TAKAHAGI Takayuki
Graduate School of Advanced Sciences of Matter, Hiroshima University
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WANG Zenglin
Graduate School of Advanced Science of Matter, Hiroshima University
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YAEGASHI Osamu
Graduate School of Advanced Science of Matter, Hiroshima University
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Wang Z
Tokyo Inst. Technol. Tokyo Jpn
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