Effect of Additives on Hole Filling Characteristics of Electroless Copper Plating

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概要

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• The effects of additives, such as Cl-, thiourea, benzotriazole, bis(3-sulfopropyl)-disulfide (SPS), and mercaptonicotinic acid, upon the hole filling characteristic of electroless Cu plating were investigated. With the addition of thiourea, the Cu deposition rate was suppressed and the hole filling characteristic became anti-bottom-up filling with the presence of voids. With the addition of SPS, bottom-up Cu filling was achieved and the bottom-up tendency increased with an increase in SPS concentration. The mechanism of anti-bottom-up filling and bottom-up filling with the addition of thiourea or SPS is attributed to the diffusion flux of thiourea being higher than that of Cu2+-EDTA complex, and the diffusion flux of SPS being lower than that of Cu2+-EDTA complex.

• INSTITUTE OF PURE AND APPLIED PHYSICSの論文
• 2004-10-15

著者

• YAEGASHI Osamu

  Graduate School of Advanced Science of Matter, Hiroshima University

• Wang Zenglin

  Graduate School Of Advanced Science Of Matter Hiroshima University

• Sakaue Hiroyuki

  Graduate School Of Advanced Science Of Matter Hiroshima University

• Takahagi Takayuki

  Graduate School of Advance Science of Matter, Hiroshima University, 1-3 Kagamiyama, Higashi-Hiroshima, Hiroshima 739-8526, Japan

• Shingubara Shoso

  Graduate School of Advanced Science of Matter, Hiroshima University, 1-3-1 Kagamiyama, Higashi-Hiroshima 739-8530, Japan

• Shingubara Shoso

  Graduate School of Advanced Science of Matter, Hiroshima University, 1-3-1 Kagamiyama, Higashi-Hiroshima 739-8526, Japan

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