Takahagi Takayuki | Graduate School of Advance Science of Matter, Hiroshima University, 1-3 Kagamiyama, Higashi-Hiroshima, Hiroshima 739-8526, Japan

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著作論文

1P169 タンパク質標識に用いる金ナノ粒子の作製法の開発(分子モーター,第48回日本生物物理学会年会)
1P170 金ナノ粒子を用いた細胞質ダイニン複合体の電子顕微鏡観察(分子モーター,第48回日本生物物理学会年会)
1P171 多機能GFPタグで見えてきた哺乳類細胞におけるダイニン-ダイナクチンのダイナミックな動態(分子モーター,第48回日本生物物理学会年会)
Fabrication of Carbon Nanotube and Nanorod Arrays Using Nanoporous Templates
Formation of Al Dot Hexagonal Array on Si Using Anodic Oxidation and Selective Etching : Surfaces, Interfaoes, and Films
Adsorbed Water on a Silicon Wafer Surface Exposed to Atmosphere : Semiconductors
Study of a Dielectric Constant Due to Electronic Polarization Using a Semiempirical Molecular Orbital Method I : Semiconductors
Scanning Electron Microscope Observation of Heterogeneous Three-Dimensional Nanoparticle Arrays Using DNA : Surfaces, Interfaces, and Films
Adsorption of Dibutyl Phthalate and Dioctyl Phthalate on Si Substrate
Analysis of Chemical Structures of Ulthathin Oxynitride Films by X-Ray Photoelectron Spectroscopy and Secondary Ion Mass Spectrometry
Corrosion Prevention of Pure Iron Using Self-Assembled Monolayer Coating
Simple Method of Synthesizing Nickel--Nitrilotriacetic Acid Gold Nanoparticles with a Narrow Size Distribution for Protein Labeling
Analysis of Chemical Structures of Ultrathin Oxynitride Films by X-Ray Photoelectron Spectroscopy and Secondary Ion Mass Spectrometry
Thickness Dependences of Nucleation and Annihilation Fields of Magnetic Vortices in Submicron Supermalloy Dots
Highly Adhesive Electroless Cu Layer Formation Using an Ultra Thin Ionized Cluster Beam (ICB)-Pd Catalytic Layer for Sub-100 nm Cu Interconnections
Climbing Rates of Microtubules Propelled by Dynein after Collision with Microfabricated Walls
Influence of Surface Oxide of Sputtered TaN on Displacement Plating of Cu
Adsorption of Dibutyl Phthalate and Dioctyl Phthalate on Si Substrate
Computer-Aided Chemistry Estimation Method of Electronic-Polarization Dielectric Constants for the Molecular Design of Low-$k$ Materials
Contact Resistance Reduction Using Vacuum Loadlock System and Plasma Dry Cleaning
Adsorbed Water on a Silicon Wafer Surface Exposed to Atmosphere
Effect of Additives on Hole Filling Characteristics of Electroless Copper Plating

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