Localized Plasma Processing of Materials Using Atmospheric-Pressure Microplasma Jets

スポンサーリンク

概要

• 論文の詳細を見る
• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2003-06-30

著者

• HORIIKE Yasuhiro

  Department of Electrical Engineering, Toyo University

• Ikeda K

  Technical Office Tsuruoka National College Of Technology

• YOSHIKI Hiroyuki

  Department of Electrical and Electronic Engineering, Tsuruoka National College of Technology

• IKEDA Koichi

  Technical Office, Tsuruoka National College of Technology

• WAKAKI Akihiro

  Uzen Parts

• TOGASHI Seisuke

  Togashi Denshi Service

• TANIGUCHI Kazutaka

  Department of Materials Science, The University of Tokyo

関連論文

• Negative Ion Assisted Silicon Oxidation in Downstream of Microwave Plasma
• Measurement of Fluorocarbon Radicals Generated from C_4F_8/H_2 Inductively Coupled Plasma : Study on SiO_2 Selective Etching Kinetics
• Microloading Effect in Highty Selective Si0_2 Contact Hole Etching Employing Inductively Coupled Plasma
• Effect of Magnetic Field to Etching Characteristics of Inductively Coupled Plasma ( Plasma Processing)
• High Rate and Highly Selective SiO_2 Etching Employing Inductively Coupled Plasma
• RF Self-Bias Characteristics in Inductively Coupled Plasma
• Al Etching Characteristics Ernploying Helicon Wave Plasma
• Si Etching Employing Steady-State Magnetron Plasma with Magnet at Anode Centered in a Cylindrical Reactor
• Gap-filling of Cu Employing Sustained Self-Sputtering with Inductively Coupled Plasma Ionization
• A Model for Resolution Dependent Roughness Values Measured by an Optical Profiler for Specific Surfaces
• Enhancement of Negative-Ion-Assisted Silicon Oxidation by Radio-Frequency Bias
• Development and Plasma Characteristics Measurement of Planar-Type Magnetic Neutral Loop Discharge Etcher
• Highly Selective SiO_2/Si Etching and Related Kinetics in Time-Modulated Helicon Wave Plasma
• SiO_2 Etching Employing Inductively Coupled Plasma with Hot Inner Wall
• Mechanism of Cloudy Surface Generation on Si Wafer Employing Numerically Controlled Local Dry Etching (NC-LDE)
• In-Situ X-Ray Photoelectron Spectroscopy of Reactive-Ion-Etched Surfaces of Indium-Tin Oxide Film Employing Alcohol Gas
• Concentration and Injection of Long Deoxyribonucleic Acid Molecules at the Interface of Micro- and Nano-channels
• Curvature Entropy Trapping of Long DNA under Hydrodynamic Flows in Microfluidic Devices
• Fluorescence Emission Control of Long DNA Molecules Adsorbed on microelectrode Surfaces by External Voltage
• Healthcare Chip for Checking Health Condition from Analysis of Trace Blood Collected by Painless Needle
• Study on the Mechanisms of Chemical Mechanical Polishing on Copper and Aluminum Surfaces Employing In Situ Infrared Spectroscopy
• Molecular Detection in a Microfluidic Device by Streaming Current Measurements
• Translocation of a Long DNA Chain Passing Through a Nanofabricated Pore
• A Study on Mechanism of Chemical Mechanical Polishing on Al and Cu Surfaces Employing In-situ Infrared Spectroscopy
• Cleaning of Silicon Surfaces by NF_3-Added Hydrogen and Water-Vapor Plasma Downstream Treatment
• Heliconwave Plasma Which Contains Negative Ion
• Biochip Which Examines Hepatic Function by Employing Colorimetric Method
• Etching Reactivity of Negative Ions Generated in Cl_2 Downstream Plasma
• Electron Energy Control in Inductively Coupled Plasma Employing Multimode Antenna
• Thin Film Detection Employing Frequency Shift in Sheath Current Oscillation
• Excitation of Sheath Oscillating Current by Superimposing Pulse Voltage
• Atomic Layer Controlled Digital Etching of Silicon : Etching and Deposition Technology
• Atomic Layer Controlled Digital Etching of Silicon
• Fabrication of Quartz Microcapillary Electrophoresis Chips Using Plasma Etching
• Gap-Filling of Cu Employing Self-Sustained Sputtering with ICP Ionization
• In-Situ Observation of Oxygen Exposed Hydrogen Terminated Silicon Surfaces
• Silicon Etching Employing Negative Ion in SF_6 Plasma
• Study on the Mechanism of Silicon Chemical Mechanical Polishing Employing In Situ Infrared Spectroscopy
• Selective Processing of Individual Carbon-Nanotubes Using Atomic Force Microscopy Installed in Transmission Electron Microscope
• A New Inside-Type Segmented Coil Antenna for Uniformity Control in a Large-Area Inductively Coupled Plasma
• Generation of Air Microplasma Jet and Its Application to Local Etching of Polyimide Films
• Generation of Integrated Atmospheric-Pressure Microplasmas
• Localized Plasma Processing of Materials Using Atmospheric-Pressure Microplasma Jets
• Localized Removal of a Photoresist by Atmospheric Pressure Micro-plasma Jet Using RF Corona Discharge
• Conelike Defect in Deep Quartz Etching Employing Neutral Loop Discharge
• Numerically Controlled Dry Etching Technology for Flattening of Si Wafer which Employs SF_6/H_2 Downstream Plasma
• Study on Reaction Mechanism of Aluminum Selective Chemical Vapor Deposition with In-situ XPS Measurement : Etching and Deposition Technology
• Study on Reaction Mechanism of Aluminum Selective Chemical Vapor Deposition with In-situ XPS Measurement
• Characteristics of Very High-Aspect-Ratio Contact Hole Etching
• Photoexcited Anisotropic Etching of Single-Crystalline Silicon
• High-Rate Bias Sputtering Filling of SiO2 Film Employing Both Continuous Wave and Time-Modulated Inductively Coupled Plasmas
• Generation of Air Microplasma Jet and Its Application to Local Etching of Polyimide Films
• Localized Plasma Processing of Materials Using Atmospheric-Pressure Microplasma Jets
• Generation of Integrated Atmospheric-Pressure Microplasmas

もっと見る 閉じる

スポンサーリンク