大重量主軸台の原子レベル超磁歪位置決め/アライメントシステムの開発 : φ300mmSiウエハ超加工機械の中核技術

概要

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In order to achieve damage free surface of Si wafer by a single step grinding process, each cutting edge should be controlled below the critical depth of cut. Additionally, the achievable wafer flatness by infeed grinding significantly depends upon the alignment between the wafer and the wheel. As one of the core technologies of an integrated manufacturing system for Φ300mm silicon wafer, a GMM (giant magnetostrictive material) actuated positioning/alignment device has been designed and developed to control half a ton payload at Åresolution over the several μm stroke range (about 5μm) and simultaneously to align the co-axis between the work and wheel at the resolution of 0.1". This paper describes the design of the GMM actuator and elastically deformable mechanism for position/alignment, the control schemes and on-situ performance.
公益社団法人精密工学会の論文
2003-01-05