204 大口径薄片SiウエハのOn-Machine 3D形状計測システムの開発(精密/微細加工と評価,オーガナイズドセッション)

概要

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The miniaturization and integration of IC chips are increasingly demanded by mobile devices. As a cost effective solution, low-profile-package containing multi layers chips is a new trend for the applications like IC card, mobile phone and digital music player. Ever thinner and flatter Si wafers are required for those applications in addition to larger size. So the measurement and evaluation of wafer flatness and thickness became important. In this paper, to solve the conventional measurement problem, also in response to the semiconductor industry's need for thin wafer manufacturing, we use multi probes to develop a new metrology system for one-side and on-machine measuring. The new system makes it possible to measure not only the wafer flatness and the wafer thickness, but also the tilt angle and alignment of the spindle.
一般社団法人日本機械学会の論文
2008-09-12