半導体素子保護用ポリイミド表面のプラズマ処理

概要

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Surface plasma treatments of protecting polyimide films of semiconductor devices have been applied to improve adhesion between polyimide and molding resin Ar, N_2 and 0_2 were used as plasma gases for surface treatments, and the difference of the surface properties for each plasma-treated polyimide film was studied. The contact angle with glycerin decreased by N_2 and 0_2 plasma treatments . The electrical resistivity of polyimide surface decreased with the Ar plasma treatment. XPS (X-ray Photoelectron Spectroscopy) measurements revealed that the Ar plasma-treated polyimide surface was carbon rich and N_2 and 0_2 plasma treated cnes had large number of C=O and C-N bonds. We believe that the carbon-rich layer makes the electrical conductive layer on the polyimide surface, and hydrophilic bondings (C=O, C-N) reduce the contact angle and improve adhesion between polyimide and molding resin.
公益社団法人精密工学会の論文
2000-05-05