Integrated RF-MEMS Technology with Wafer-Level Encapsulation
スポンサーリンク
概要
- 論文の詳細を見る
- 2005-09-13
著者
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Sato Norio
Ntt Corp. Kanagawa Jpn
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URANO Masami
NTT Microsystem Integration Laboratories
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SAKATA Tomomi
NTT Microsystem Integration Laboratories
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ISHII Hiromu
NTT Microsystem Integration Laboratories
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MACHIDA Katsuyuki
NTT Microsystem Integration Laboratories
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Kodate Junichi
Ntt Microsystem Integration Laboratories Ntt Corporation
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YANO Masaki
NTT Advanced Technology Corporation, NTT Corporation
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Urano Masami
Ntt Microsystem Integration Laboratories Ntt Corporation
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SATO Norio
NTT Microsystem Integration Labs.
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KAMEI Toshikazu
NTT Advanced Technology Corp.
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KUDOU Kazuhisa
NTT Advanced Technology Corp.
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KUWABARA Kei
NTT Microsystem Integration Laboratories, NTT Corporation
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MACHIDA Katsuyuki
NTT Advanced Technology Corporation
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Yano Masaki
Ntt Advanced Technology Corporation
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Kudou Kazuhisa
Ntt Advanced Technology Corporation
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Sato Norio
Ntt Microsystem Integration Lab. Kanagawa Jpn
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Kuwabara Kei
Ntt Microsystem Integration Laboratories Ntt Corporation
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Sahri N
Ntt Microsystem Integration Laboratories Ntt Corporation
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Ishii Hiromu
Ntt Microsystem Integration Laboratories Ntt Corporation
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Machida K
Ntt Advanced Technology Corporation
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Kamei Toshikazu
Ntt Advanced Technology Corporation
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Kodate Junichi
Ntt Microsystem Integration Laboratories
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Yano Masaki
NTT Advanced Technology Corp.
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- Selective Electrodeposition Technology for Organic Insulator Films on Microelectromechanical-System Structures
- Anti-Sticking Effect of Organic Dielectric Formed by Electrodeposition in Microelectromechanical-System Structures
- The effect of thick interconnections formed by gold electroplating on the characteristics of metal-oxide-semiconductor field-effect transistors
- Thick Au High-Q Inductor and Its Chip-on-Chip Bonding on an RF IC for Various Frequencies
- RF-MEMS Switch Structure for Low-Voltage Actuation and High-Density Integration
- Characterization of air-gap sealing with organic dielectric using spin-coating film transfer and hot-pressing technology
- Peel-off characteristics at interface between base film and dielectrics with spin-coating film transfer and hot-pressing technology
- Novel Structure and Fabrication Process for Integrated RF Microelectromechanical-System Technology
- Electrodeposition of Organic Dielectric Film and Its Application to Vibrational Microelectromechanical System Devices
- Integrated RF-MEMS Technology with Wafer-Level Encapsulation
- Force-Sensing Scheme for Small Mechanical Signals in Complementary Metal Oxide Semiconductor Microelectromechanical System Fingerprint Sensor
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- Advanced Spin Coating Film Transfer and Hot-Pressing Process for Global Planarization with Dielectric-Material-Viscosity Control
- Evaluation of Sensitivity on a Capacitive Fingerprint Sensor LSI with a Grounded Wall Structure
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- Stress-Induced Device Degradation Due to Die-Attach Process after Area Bump Formation
- Fabrication of a Microelectromechanical System Mirror Array and Its Drive Electrodes for Low Electrical Interference in Wavelength-Selective Switches
- Ubiquitous User Authentication System with Wireless Battery-Powered Fingerprint Identification Module
- Surface Cleaning of Gold Structure by Annealing during Fabrication of Microelectromechanical System Devices
- Removal of Gold Oxide by Low-Temperature Hydrogen Annealing for Microelectromechanical System Device Fabrication
- Selective Removal of Dry-Etching Residue Derived from Polymer Sacrificial Layer for Microelectromechanical-System Device Fabrication
- Removal of Gold Oxide by Low-Temperature Hydrogen Annealing for Microelectromechanical System Device Fabrication
- Characterization of Air-Gap Sealing with Organic Dielectric Using Spin-Coating Film Transfer and Hot-Pressing Technology
- Synchronized Multiple-Array Vibrational Device for Microelectromechanical System Electrostatic Energy Harvester
- Effect of Ground-Wall Structure in Capacitive Fingerprint Sensor on Electrostatic Discharge Tolerance
- The Effect of Thick Interconnections Formed by Gold Electroplating on the Characteristics of Metal–Oxide–Semiconductor Field-Effect Transistors
- Practical High-Resistivity Silicon-on-Insulator Solution for Spiral Inductors in Radio-Frequency Integrated Circuits
- Novel Packaging Technology for Microelectromechanical-System Devices
- Spin Coating Film Transfer and Hot-Pressing System for Uniform Dielectric Formation and Its Application to Porous Low-$k$ Film Formation
- Electrodeposition of Water-Repellent Organic Dielectric Film as an Anti-Sticking Coating on Microelectromechanical System Devices
- A Sealing Technique for Stacking MEMS on LSI Using Spin-Coating Film Transfer and Hot Pressing
- Fabrication of Optical Microelectromechanical-System Switches Having Multilevel Mirror-Drive Electrodes
- Peel-Off Characteristics at Interface between Base Film and Dielectrics with Spin-Coating Film Transfer and Hot-Pressing Technology
- Force-Sensing Scheme for Small Mechanical Signals in Complementary Metal Oxide Semiconductor Microelectromechanical System Fingerprint Sensor
- Thick-Dielectric Formation and MOSFET Reliability with Spin-Coating Film Transfer and Hot-Pressing Technique for Seamless Integration Technology
- Monolithic Integration Fabrication Process of Thermoelectric and Vibrational Devices for Microelectromechanical System Power Generator
- Electrodeposition of Organic Dielectric Film and Its Application to Vibrational Microelectromechanical System Devices
- A reliable procedure in a new power management technique for a 200-Gbps packet forwarding LSI