Ishii Hiromu | Ntt Microsystem Integration Laboratories Ntt Corporation

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著作論文

Thick On-Chip Interconnections by Cu-Damascene Processes Using a Photosensitive Polymer
Selective Electrodeposition Technology for Organic Insulator Films on Microelectromechanical-System Structures
Anti-Sticking Effect of Organic Dielectric Formed by Electrodeposition in Microelectromechanical-System Structures
Thick Au High-Q Inductor and Its Chip-on-Chip Bonding on an RF IC for Various Frequencies
RF-MEMS Switch Structure for Low-Voltage Actuation and High-Density Integration
Novel Structure and Fabrication Process for Integrated RF Microelectromechanical-System Technology
Integrated RF-MEMS Technology with Wafer-Level Encapsulation
A New Fabrication Process for Low-Loss Millimeter-Wave Transmission Lines on Silicon
Microfabrication Technology for Millimeter-Wave Photonic Systems on Si
Fabrication of a Microelectromechanical System Mirror Array and Its Drive Electrodes for Low Electrical Interference in Wavelength-Selective Switches

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