Machida K | Ntt Advanced Technology Corporation

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概要

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著作論文

An Adaptive Fingerprint-Sensing Scheme for a User Authentication System with a Fingerprint Sensor LSI(Integrated Electronics)
Thick On-Chip Interconnections by Cu-Damascene Processes Using a Photosensitive Polymer
Selective Electrodeposition Technology for Organic Insulator Films on Microelectromechanical-System Structures
Anti-Sticking Effect of Organic Dielectric Formed by Electrodeposition in Microelectromechanical-System Structures
Thick Au High-Q Inductor and Its Chip-on-Chip Bonding on an RF IC for Various Frequencies
RF-MEMS Switch Structure for Low-Voltage Actuation and High-Density Integration
Novel Structure and Fabrication Process for Integrated RF Microelectromechanical-System Technology
Integrated RF-MEMS Technology with Wafer-Level Encapsulation
Characteristics of Fingerprint Sensing on Capacitive Fingerprint Sensor LSIs with a Grounded Wall Structure
Advanced Spin Coating Film Transfer and Hot-Pressing Process for Global Planarization with Dielectric-Material-Viscosity Control
Evaluation of Sensitivity on a Capacitive Fingerprint Sensor LSI with a Grounded Wall Structure
Logic and Analog Test Schemes for a Single-Chip Pixel-Parallel Fingerprint Identification LSI(Image Sensor/Vision Chip,VLSI Technology toward Frontiers of New Market)
Fingerprint Image Enhancement and Rotation Schemes for a Single-Chip Fingerprint Sensor and Identifier(Electronic Circuits)
Copper Damascene Interconnection with Tungsten Silicon Nitride Diffusion Barrier Formed by Electron Cyclotron Resonance Plasma Nitridation
Diffusion Barrier Mechanism of Extremely Thin Tungsten Silicon Nitride Film Formed by ECR Plasma Nitridation
A New Fabrication Process for Low-Loss Millimeter-Wave Transmission Lines on Silicon
Pixel-Parallel Image-Matching Circuit Schemes for a Single-Chip Fingerprint Sensor and Identifier(Electronic Circuits)
Fingerprint Identification System on a Single Chip Based on Advanced Circuit and Device Technologies
Microfabrication Technology for Millimeter-Wave Photonic Systems on Si
The Influence of Stud Bumping above the MOSFETs on Device Reliability(Special Section on Reliability Theory and Its Applications)
Stress-Induced Device Degradation Due to Die-Attachment Process after Area Bump Formation
Stress-Induced Device Degradation Due to Die-Attach Process after Area Bump Formation
Ubiquitous User Authentication System with Wireless Battery-Powered Fingerprint Identification Module

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