SHIMAMURA Toshishige | NTT Microsystem Integration Laboratories

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概要

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著作論文

Novel Packaging Technology for Microelectromechanical-System Devices
An Adaptive Fingerprint-Sensing Scheme for a User Authentication System with a Fingerprint Sensor LSI(Integrated Electronics)
Electrodeposition of Organic Dielectric Film and Its Application to Vibrational Microelectromechanical System Devices
Logic and Analog Test Schemes for a Single-Chip Pixel-Parallel Fingerprint Identification LSI(Image Sensor/Vision Chip,VLSI Technology toward Frontiers of New Market)
Fingerprint Image Enhancement and Rotation Schemes for a Single-Chip Fingerprint Sensor and Identifier(Electronic Circuits)
A Capacitive Sensing Scheme for Control of Movable Element with Complementary Metal–Oxide–Semiconductor Microelectoromechanical-Systems Device
A Sub-0.5V Differential ED-CMOS/SOI Circuit with Over-1-GHz Operation(Digital, Low-Power LSI and Low-Power IP)
Design and Performance of a Sub-Nano-Ampere Two-Stage Power Management Circuit in 0.35-μm CMOS for Dust-Size Sensor Nodes
Synchronized Multiple-Array Vibrational Device for Microelectromechanical System Electrostatic Energy Harvester
Novel Packaging Technology for Microelectromechanical-System Devices
Electrodeposition of Water-Repellent Organic Dielectric Film as an Anti-Sticking Coating on Microelectromechanical System Devices
Fabrication of Optical Microelectromechanical-System Switches Having Multilevel Mirror-Drive Electrodes
Electrodeposition of Organic Dielectric Film and Its Application to Vibrational Microelectromechanical System Devices

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