Design and Performance of a Sub-Nano-Ampere Two-Stage Power Management Circuit in 0.35-μm CMOS for Dust-Size Sensor Nodes
スポンサーリンク
概要
- 論文の詳細を見る
The design and performance of a sub-nanoampere two-stage power management circuit that uses off-chip capacitors for energy accumulation are presented. Focusing on the leakage current and the transition time of the power switch transistor, we estimated the minimum current for accumulating. On the basis of the results, we devised a two-stage power management architecture for sub-nanoampere operation. The simulated and experimental results for the power management circuit describe the accumulating operation with a 1-nA current source.
- （社）電子情報通信学会の論文
- 2011-07-01
著者
-
Harada Mitsuru
Ntt Microsystem Integration Labs. Ntt Corporation
-
SHIMAMURA Toshishige
NTT Microsystem Integration Laboratories
-
Mutoh Shin'ichiro
Ntt Microsystem Integration Laboratories Ntt Corporation
-
Ugajin Mamoru
Ntt Microsystem Integration Laboratories Ntt Corporation
-
Shimamura Toshishige
Ntt Microsystem Integration Laboratories Ntt Corporation
-
Harada Mitsuru
Ntt Microsystem Integration Laboratories Ntt Corporation
-
Ugajin Mamoru
Ntt Microsystem Integration Laboratories
-
HARADA Mitsuru
NTT Microsystem Integration Laboratories
関連論文
- Novel Packaging Technology for Microelectromechanical-System Devices
- A Low-Voltage 6-GHz-Band CMOS Monolithic LC-Tank VCO Using a Tuning-Range Switching Technique(Special Section on Analog Circuit Techniques Supporting the System LSI Era)
- Suppression of Substrate Crosstalk in Mixed-Signal Complementary MOS Circuits Using High-Resistivity SIMOX(Separation by IMplanted OXygen)Wafers
- Suppression of Substrate Crosstalk in Mixed Analog-Digital CMOS Circuits by Using High-Resistivity SIMOX Wafers
- An Adaptive Fingerprint-Sensing Scheme for a User Authentication System with a Fingerprint Sensor LSI(Integrated Electronics)
- Low-Cost Millimeter-Wave Photonic Techniques for Gigabit/s Wireless Link(Photonic Links for Wireless Communications)(Special Issue on Recent Progress in Microwave and Millimeter-wave Photonics Technologies)
- 3.0 Gbit/s Wireless Links Using 120-GHz Millimeter-Wave Photonic Techniques
- Gain Improvement of a 2.4-GHz/5-GHz CMOS Low Noise Amplifier by Using High-Resistivity Silicon-on-Insulator Wafers
- Electrodeposition of Organic Dielectric Film and Its Application to Vibrational Microelectromechanical System Devices
- Gain Improvement of a 2.4-GHz/5-GHz CMOS Low Noise Amplifier by Using High-Resistivity Silicon-on-Insulator Wafers(Devices and Circuits for Next Generation Multi-Media Communication Systems)
- Logic and Analog Test Schemes for a Single-Chip Pixel-Parallel Fingerprint Identification LSI(Image Sensor/Vision Chip,VLSI Technology toward Frontiers of New Market)
- Fingerprint Image Enhancement and Rotation Schemes for a Single-Chip Fingerprint Sensor and Identifier(Electronic Circuits)
- A 2.4-GHz PLL Synthesizer for a 1-V Bluetooth RF Transceiver(Analog Circuit and Device Technologies)
- Low dc Power Si-MOSFET L- and C-Band Low Noise Amplifiers Fabricated by SIMOX Technology (Special Issue on Ultra-High-Speed IC and LSI Technology)
- A 1-V 2.4-GHz Downconverter for FSK Wireless Applications with a Complex BPF and a Frequency Doubler in CMOS/SOI(Analog Circuit and Device Technologies)
- A 1-V 2-GHz RF Receiver with 49 dB of Image Rejection in CMOS/SIMOX(Special Section on Analog Circuit Techniques and Related Topics)
- A 6-bit A/D Converter for MEMS-control circuit
- A Capacitive Sensing Scheme for Control of Movable Element with Complementary Metal–Oxide–Semiconductor Microelectoromechanical-Systems Device
- A Sub-0.5V Differential ED-CMOS/SOI Circuit with Over-1-GHz Operation(Digital, Low-Power LSI and Low-Power IP)
- A 5th-Order SC Complex BPF Using Series Capacitances for Low-IF Narrowband Wireless Receivers
- Design and Performance of a Sub-Nano-Ampere Two-Stage Power Management Circuit in 0.35-μm CMOS for Dust-Size Sensor Nodes
- A 1-Mbps 1.6-μA Active-RFID CMOS LSI for the 300-MHz Frequency Band with an All-Digital RF Transmitting Scheme
- Operation of Ultra-Low Leakage Regulator Circuits with SOI and Bulk Technologies for Controlling Wireless Transceivers
- Third-Harmonic Envelope Feedback Method for High-Efficiency Linear Power Amplifiers
- Third-Harmonic Envelope Feedback Method for High-Efficiency Linear Power Amplifiers
- Synchronized Multiple-Array Vibrational Device for Microelectromechanical System Electrostatic Energy Harvester
- Novel Packaging Technology for Microelectromechanical-System Devices
- Electrodeposition of Water-Repellent Organic Dielectric Film as an Anti-Sticking Coating on Microelectromechanical System Devices
- Fabrication of Optical Microelectromechanical-System Switches Having Multilevel Mirror-Drive Electrodes
- Electrodeposition of Organic Dielectric Film and Its Application to Vibrational Microelectromechanical System Devices
- A 280-MHz CMOS Intra-Symbol Intermittent RF Front End for Adaptive Power Reduction of Wireless Receivers According to Received-Signal Intensity in Sensor Networks