Novel Packaging Technology for Microelectromechanical-System Devices

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Novel Packaging Technology for Microelectromechanical-System Devices
An Adaptive Fingerprint-Sensing Scheme for a User Authentication System with a Fingerprint Sensor LSI(Integrated Electronics)
Selective Electrodeposition Technology for Organic Insulator Films on Microelectromechanical-System Structures
Anti-Sticking Effect of Organic Dielectric Formed by Electrodeposition in Microelectromechanical-System Structures
Thick Au High-Q Inductor and Its Chip-on-Chip Bonding on an RF IC for Various Frequencies
RF-MEMS Switch Structure for Low-Voltage Actuation and High-Density Integration
Novel Structure and Fabrication Process for Integrated RF Microelectromechanical-System Technology
Electrodeposition of Organic Dielectric Film and Its Application to Vibrational Microelectromechanical System Devices
Integrated RF-MEMS Technology with Wafer-Level Encapsulation
Thick-Dielectric Formation and MOSFET Reliability with Spin-Coating Film Transfer and Hot-Pressing Technique for Seamless Integration Technology
Logic and Analog Test Schemes for a Single-Chip Pixel-Parallel Fingerprint Identification LSI(Image Sensor/Vision Chip,VLSI Technology toward Frontiers of New Market)
Fingerprint Image Enhancement and Rotation Schemes for a Single-Chip Fingerprint Sensor and Identifier(Electronic Circuits)
A Sealing Technique for Stacking MEMS on LSI Using Spin-Coating Film Transfer and Hot Pressing
A 6-bit A/D Converter for MEMS-control circuit
Effect of Ground-Wall Structure in Capacitive Fingerprint Sensor on Electrostatic Discharge Tolerance
Pixel-Parallel Image-Matching Circuit Schemes for a Single-Chip Fingerprint Sensor and Identifier(Electronic Circuits)
Microfabrication Technology for Millimeter-Wave Photonic Systems on Si
A Capacitive Sensing Scheme for Control of Movable Element with Complementary Metal–Oxide–Semiconductor Microelectoromechanical-Systems Device
Conformal Coating of Organic Dielectric Film on Gold Electrodes in Microelectromechanical System Devices by Electrodeposition
A Sub-0.5V Differential ED-CMOS/SOI Circuit with Over-1-GHz Operation(Digital, Low-Power LSI and Low-Power IP)
Fabrication of a Microelectromechanical System Mirror Array and Its Drive Electrodes for Low Electrical Interference in Wavelength-Selective Switches
Design and Performance of a Sub-Nano-Ampere Two-Stage Power Management Circuit in 0.35-μm CMOS for Dust-Size Sensor Nodes
Surface Cleaning of Gold Structure by Annealing during Fabrication of Microelectromechanical System Devices
Removal of Gold Oxide by Low-Temperature Hydrogen Annealing for Microelectromechanical System Device Fabrication
Selective Removal of Dry-Etching Residue Derived from Polymer Sacrificial Layer for Microelectromechanical-System Device Fabrication
Removal of Gold Oxide by Low-Temperature Hydrogen Annealing for Microelectromechanical System Device Fabrication
Characterization of Air-Gap Sealing with Organic Dielectric Using Spin-Coating Film Transfer and Hot-Pressing Technology
Synchronized Multiple-Array Vibrational Device for Microelectromechanical System Electrostatic Energy Harvester
Effect of Ground-Wall Structure in Capacitive Fingerprint Sensor on Electrostatic Discharge Tolerance
The Effect of Thick Interconnections Formed by Gold Electroplating on the Characteristics of Metal–Oxide–Semiconductor Field-Effect Transistors
Novel Packaging Technology for Microelectromechanical-System Devices
Electrodeposition of Water-Repellent Organic Dielectric Film as an Anti-Sticking Coating on Microelectromechanical System Devices
A Sealing Technique for Stacking MEMS on LSI Using Spin-Coating Film Transfer and Hot Pressing
Fabrication of Optical Microelectromechanical-System Switches Having Multilevel Mirror-Drive Electrodes
Force-Sensing Scheme for Small Mechanical Signals in Complementary Metal Oxide Semiconductor Microelectromechanical System Fingerprint Sensor
Thick-Dielectric Formation and MOSFET Reliability with Spin-Coating Film Transfer and Hot-Pressing Technique for Seamless Integration Technology
Monolithic Integration Fabrication Process of Thermoelectric and Vibrational Devices for Microelectromechanical System Power Generator
Electrodeposition of Organic Dielectric Film and Its Application to Vibrational Microelectromechanical System Devices
A reliable procedure in a new power management technique for a 200-Gbps packet forwarding LSI

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