Effect of Ground-Wall Structure in Capacitive Fingerprint Sensor on Electrostatic Discharge Tolerance
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概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2005-05-15
著者
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Shigematsu Satoshi
Ntt Microsystem Integration Lab. Kanagawa Jpn
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MACHIDA Katsuyuki
NTT Microsystem Integration Laboratories
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MORIMURA Hiroki
NTT Microsystem Integration Laboratories
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OKAZAKI Yukio
NTT Microsystem Integration Laboratories
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SHIMOYAMA Nobuhiro
NTT Microsystem Integration Laboratories, NTT Corporation
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Morimura Hiroki
Ntt Microsystem Integration Laboratories Ntt Corporation
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TANABE Yasuyuki
NTT Electronics
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- Thick-Dielectric Formation and MOSFET Reliability with Spin-Coating Film Transfer and Hot-Pressing Technique for Seamless Integration Technology
- Characteristics of Fingerprint Sensing on Capacitive Fingerprint Sensor LSIs with a Grounded Wall Structure
- Evaluation of Sensitivity on a Capacitive Fingerprint Sensor LSI with a Grounded Wall Structure
- Logic and Analog Test Schemes for a Single-Chip Pixel-Parallel Fingerprint Identification LSI(Image Sensor/Vision Chip,VLSI Technology toward Frontiers of New Market)
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- A Sealing Technique for Stacking MEMS on LSI Using Spin-Coating Film Transfer and Hot Pressing
- A 6-bit A/D Converter for MEMS-control circuit
- Effect of Ground-Wall Structure in Capacitive Fingerprint Sensor on Electrostatic Discharge Tolerance
- Pixel-Parallel Image-Matching Circuit Schemes for a Single-Chip Fingerprint Sensor and Identifier(Electronic Circuits)
- Fingerprint Identification System on a Single Chip Based on Advanced Circuit and Device Technologies
- Microfabrication Technology for Millimeter-Wave Photonic Systems on Si
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- Capacitance-Voltage Characteristics of Buried-Channel MOS Capacitors with a Structure of Subquarter-Micron pMOS
- Ubiquitous User Authentication System with Wireless Battery-Powered Fingerprint Identification Module
- Effect of Ground-Wall Structure in Capacitive Fingerprint Sensor on Electrostatic Discharge Tolerance
- Novel Packaging Technology for Microelectromechanical-System Devices
- A Sealing Technique for Stacking MEMS on LSI Using Spin-Coating Film Transfer and Hot Pressing
- Fabrication of Optical Microelectromechanical-System Switches Having Multilevel Mirror-Drive Electrodes
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