Novel Packaging Technology for Microelectromechanical-System Devices
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概要
- 論文の詳細を見る
In this paper, we describe a novel packaging technology for use in microelectromechanical-system (MEMS) device fabrication and its application to an optical MEMS micromirror array that consists of a mirror chip and an electrode chip that controls the micromirrors. Chip-on-chip technology, which involves the selective deposition of silver paste by screen printing, is used to join the two chips. The experimental results ensure a high production yield and heat cycle test results indicate good reliability.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2005-11-15
著者
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Tazawa Hiroshi
Misuzu Industries Corporation
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URANO Masami
NTT Microsystem Integration Laboratories
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SAKATA Tomomi
NTT Microsystem Integration Laboratories
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SHIMAMURA Toshishige
NTT Microsystem Integration Laboratories
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ISHII Hiromu
NTT Microsystem Integration Laboratories
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CHINO Mitsuru
Misuzu Industries Corporation
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SHIMADA Teruo
Misuzu Industries Corporation
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MACHIDA Katsuyuki
NTT Microsystem Integration Laboratories
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Tazawa Hiroshi
Misuzu Industries Corporation, 1536 Nakaminowa, Minowa-machi, Kamiina-gun, Nagano 399-4601, Japan
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Shimada Teruo
Misuzu Industries Corporation, 1536 Nakaminowa, Minowa-machi, Kamiina-gun, Nagano 399-4601, Japan
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