A Sealing Technique for Stacking MEMS on LSI Using Spin-Coating Film Transfer and Hot Pressing

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Novel Packaging Technology for Microelectromechanical-System Devices
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Anti-Sticking Effect of Organic Dielectric Formed by Electrodeposition in Microelectromechanical-System Structures
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Electrodeposition of Organic Dielectric Film and Its Application to Vibrational Microelectromechanical System Devices
Integrated RF-MEMS Technology with Wafer-Level Encapsulation
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Characteristics of Fingerprint Sensing on Capacitive Fingerprint Sensor LSIs with a Grounded Wall Structure
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Evaluation of Sensitivity on a Capacitive Fingerprint Sensor LSI with a Grounded Wall Structure
Logic and Analog Test Schemes for a Single-Chip Pixel-Parallel Fingerprint Identification LSI(Image Sensor/Vision Chip,VLSI Technology toward Frontiers of New Market)
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A Sealing Technique for Stacking MEMS on LSI Using Spin-Coating Film Transfer and Hot Pressing
Ultralow-Voltage MTCMOS/SOI Circuits for Batteryless Mobile System(Low-Power System LSI, IP and Related Technologies)
A 6-bit A/D Converter for MEMS-control circuit
A New Fabrication Process for Low-Loss Millimeter-Wave Transmission Lines on Silicon
Effect of Ground-Wall Structure in Capacitive Fingerprint Sensor on Electrostatic Discharge Tolerance
Pixel-Parallel Image-Matching Circuit Schemes for a Single-Chip Fingerprint Sensor and Identifier(Electronic Circuits)
Fingerprint Identification System on a Single Chip Based on Advanced Circuit and Device Technologies
Microfabrication Technology for Millimeter-Wave Photonic Systems on Si
A Capacitive Sensing Scheme for Control of Movable Element with Complementary Metal–Oxide–Semiconductor Microelectoromechanical-Systems Device
Conformal Coating of Organic Dielectric Film on Gold Electrodes in Microelectromechanical System Devices by Electrodeposition
Ubiquitous User Authentication System with Wireless Battery-Powered Fingerprint Identification Module
Surface Cleaning of Gold Structure by Annealing during Fabrication of Microelectromechanical System Devices
Selective Removal of Dry-Etching Residue Derived from Polymer Sacrificial Layer for Microelectromechanical-System Device Fabrication
Removal of Gold Oxide by Low-Temperature Hydrogen Annealing for Microelectromechanical System Device Fabrication
Characterization of Air-Gap Sealing with Organic Dielectric Using Spin-Coating Film Transfer and Hot-Pressing Technology
Effect of Ground-Wall Structure in Capacitive Fingerprint Sensor on Electrostatic Discharge Tolerance
The Effect of Thick Interconnections Formed by Gold Electroplating on the Characteristics of Metal–Oxide–Semiconductor Field-Effect Transistors
Novel Packaging Technology for Microelectromechanical-System Devices
Spin Coating Film Transfer and Hot-Pressing System for Uniform Dielectric Formation and Its Application to Porous Low-$k$ Film Formation
Electrodeposition of Water-Repellent Organic Dielectric Film as an Anti-Sticking Coating on Microelectromechanical System Devices
A Sealing Technique for Stacking MEMS on LSI Using Spin-Coating Film Transfer and Hot Pressing
Fabrication of Optical Microelectromechanical-System Switches Having Multilevel Mirror-Drive Electrodes
Peel-Off Characteristics at Interface between Base Film and Dielectrics with Spin-Coating Film Transfer and Hot-Pressing Technology
Force-Sensing Scheme for Small Mechanical Signals in Complementary Metal Oxide Semiconductor Microelectromechanical System Fingerprint Sensor
Thick-Dielectric Formation and MOSFET Reliability with Spin-Coating Film Transfer and Hot-Pressing Technique for Seamless Integration Technology
Monolithic Integration Fabrication Process of Thermoelectric and Vibrational Devices for Microelectromechanical System Power Generator
Electrodeposition of Organic Dielectric Film and Its Application to Vibrational Microelectromechanical System Devices

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