Peel-Off Characteristics at Interface between Base Film and Dielectrics with Spin-Coating Film Transfer and Hot-Pressing Technology

スポンサーリンク

概要

• 論文の詳細を見る

• This paper describes the peel-off characteristics of spin-coating film transfer and hot-pressing (STP) technology. STP technology is a new film-formation technology that enables the transfer of a dielectric on a base film onto a wafer by hot pressing. The base film is then peeled off at the interface between the base film and the dielectric. It is examined to control the peel force by the surface treatment of the base film of a fluoropolymer and STP process conditions. An apparatus for measuring peel force during peel off is also devised. The measurement results clarified that the magnitude of the normalized peel force ranges from about 2 to 3 N/cm for a 1-μm-thick dielectric, depending on the surface treatment and STP process conditions. The X-ray photoelectron spectroscopy spectrum of the surface of the base film after peel off indicated that peel off was carried out at the interface. Therefore, it is confirmed that STP technology enables the control of the characteristics of peel off.

• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2007-10-15

著者

• KAMEI Toshikazu

  NTT Advanced Technology Corp.

• KUDOU Kazuhisa

  NTT Advanced Technology Corp.

• MACHIDA Katsuyuki

  NTT Advanced Technology Corporation

• Sato Norio

  Ntt Microsystem Integration Lab. Kanagawa Jpn

• Kamei Toshikazu

  NTT Advanced Technology Corporation, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0124, Japan

• Kawagoe Masafumi

  Dainippon Screen MFG Corporation, 322 Furukawa-cho, Hazukashi, Fushimi-ku, Kyoto 612-8486, Japan

• Adachi Hideki

  Dainippon Screen MFG Corporation, 322 Furukawa-cho, Hazukashi, Fushimi-ku, Kyoto 612-8486, Japan

• Machida Katsuyuki

  NTT Advanced Technology Corp.

• Machida Katsuyuki

  NTT Advanced Technology Corporation, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0124, Japan

関連論文

• An Adaptive Fingerprint-Sensing Scheme for a User Authentication System with a Fingerprint Sensor LSI(Integrated Electronics)
• Thick On-Chip Interconnections by Cu-Damascene Processes Using a Photosensitive Polymer
• Selective Electrodeposition Technology for Organic Insulator Films on Microelectromechanical-System Structures
• Anti-Sticking Effect of Organic Dielectric Formed by Electrodeposition in Microelectromechanical-System Structures
• Thick Au High-Q Inductor and Its Chip-on-Chip Bonding on an RF IC for Various Frequencies
• RF-MEMS Switch Structure for Low-Voltage Actuation and High-Density Integration
• Novel Structure and Fabrication Process for Integrated RF Microelectromechanical-System Technology
• Electrodeposition of Organic Dielectric Film and Its Application to Vibrational Microelectromechanical System Devices
• Integrated RF-MEMS Technology with Wafer-Level Encapsulation
• Thick-Dielectric Formation and MOSFET Reliability with Spin-Coating Film Transfer and Hot-Pressing Technique for Seamless Integration Technology
• Characteristics of Fingerprint Sensing on Capacitive Fingerprint Sensor LSIs with a Grounded Wall Structure
• Advanced Spin Coating Film Transfer and Hot-Pressing Process for Global Planarization with Dielectric-Material-Viscosity Control
• Evaluation of Sensitivity on a Capacitive Fingerprint Sensor LSI with a Grounded Wall Structure
• Logic and Analog Test Schemes for a Single-Chip Pixel-Parallel Fingerprint Identification LSI(Image Sensor/Vision Chip,VLSI Technology toward Frontiers of New Market)
• Fingerprint Image Enhancement and Rotation Schemes for a Single-Chip Fingerprint Sensor and Identifier(Electronic Circuits)
• A Sealing Technique for Stacking MEMS on LSI Using Spin-Coating Film Transfer and Hot Pressing
• Monolithic integration fabrication process of thermoelectric and vibrational devices for microelectromechanical system power generator
• Copper Damascene Interconnection with Tungsten Silicon Nitride Diffusion Barrier Formed by Electron Cyclotron Resonance Plasma Nitridation
• A New Fabrication Process for Low-Loss Millimeter-Wave Transmission Lines on Silicon
• Pixel-Parallel Image-Matching Circuit Schemes for a Single-Chip Fingerprint Sensor and Identifier(Electronic Circuits)
• Fingerprint Identification System on a Single Chip Based on Advanced Circuit and Device Technologies
• Microfabrication Technology for Millimeter-Wave Photonic Systems on Si
• A Capacitive Sensing Scheme for Control of Movable Element with Complementary Metal–Oxide–Semiconductor Microelectoromechanical-Systems Device
• Conformal Coating of Organic Dielectric Film on Gold Electrodes in Microelectromechanical System Devices by Electrodeposition
• The Influence of Stud Bumping above the MOSFETs on Device Reliability(Special Section on Reliability Theory and Its Applications)
• Stress-Induced Device Degradation Due to Die-Attachment Process after Area Bump Formation
• Stress-Induced Device Degradation Due to Die-Attach Process after Area Bump Formation
• Ubiquitous User Authentication System with Wireless Battery-Powered Fingerprint Identification Module
• Surface Cleaning of Gold Structure by Annealing during Fabrication of Microelectromechanical System Devices
• Removal of Gold Oxide by Low-Temperature Hydrogen Annealing for Microelectromechanical System Device Fabrication
• Characterization of Air-Gap Sealing with Organic Dielectric Using Spin-Coating Film Transfer and Hot-Pressing Technology
• Synchronized Multiple-Array Vibrational Device for Microelectromechanical System Electrostatic Energy Harvester
• The Effect of Thick Interconnections Formed by Gold Electroplating on the Characteristics of Metal–Oxide–Semiconductor Field-Effect Transistors
• Spin Coating Film Transfer and Hot-Pressing System for Uniform Dielectric Formation and Its Application to Porous Low-$k$ Film Formation
• Electrodeposition of Water-Repellent Organic Dielectric Film as an Anti-Sticking Coating on Microelectromechanical System Devices
• A Sealing Technique for Stacking MEMS on LSI Using Spin-Coating Film Transfer and Hot Pressing
• Fabrication of Optical Microelectromechanical-System Switches Having Multilevel Mirror-Drive Electrodes
• Peel-Off Characteristics at Interface between Base Film and Dielectrics with Spin-Coating Film Transfer and Hot-Pressing Technology
• Force-Sensing Scheme for Small Mechanical Signals in Complementary Metal Oxide Semiconductor Microelectromechanical System Fingerprint Sensor
• Thick-Dielectric Formation and MOSFET Reliability with Spin-Coating Film Transfer and Hot-Pressing Technique for Seamless Integration Technology
• Monolithic Integration Fabrication Process of Thermoelectric and Vibrational Devices for Microelectromechanical System Power Generator
• Electrodeposition of Organic Dielectric Film and Its Application to Vibrational Microelectromechanical System Devices
• Novel Sensor Structure and Its Evaluation for Integrated Complementary Metal Oxide Semiconductor Microelectromechanical Systems Accelerometer
• Novel Sensor Structure and Its Evaluation for Integrated Complementary Metal Oxide Semiconductor Microelectromechanical Systems Accelerometer

もっと見る 閉じる

スポンサーリンク