MACHIDA Katsuyuki | NTT Advanced Technology Corporation

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概要

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著作論文

An Adaptive Fingerprint-Sensing Scheme for a User Authentication System with a Fingerprint Sensor LSI(Integrated Electronics)
Thick On-Chip Interconnections by Cu-Damascene Processes Using a Photosensitive Polymer
Selective Electrodeposition Technology for Organic Insulator Films on Microelectromechanical-System Structures
Thick Au High-Q Inductor and Its Chip-on-Chip Bonding on an RF IC for Various Frequencies
RF-MEMS Switch Structure for Low-Voltage Actuation and High-Density Integration
Integrated RF-MEMS Technology with Wafer-Level Encapsulation
Characteristics of Fingerprint Sensing on Capacitive Fingerprint Sensor LSIs with a Grounded Wall Structure
Advanced Spin Coating Film Transfer and Hot-Pressing Process for Global Planarization with Dielectric-Material-Viscosity Control
Evaluation of Sensitivity on a Capacitive Fingerprint Sensor LSI with a Grounded Wall Structure
Logic and Analog Test Schemes for a Single-Chip Pixel-Parallel Fingerprint Identification LSI(Image Sensor/Vision Chip,VLSI Technology toward Frontiers of New Market)
Fingerprint Image Enhancement and Rotation Schemes for a Single-Chip Fingerprint Sensor and Identifier(Electronic Circuits)
Copper Damascene Interconnection with Tungsten Silicon Nitride Diffusion Barrier Formed by Electron Cyclotron Resonance Plasma Nitridation
A New Fabrication Process for Low-Loss Millimeter-Wave Transmission Lines on Silicon
Pixel-Parallel Image-Matching Circuit Schemes for a Single-Chip Fingerprint Sensor and Identifier(Electronic Circuits)
Fingerprint Identification System on a Single Chip Based on Advanced Circuit and Device Technologies
Microfabrication Technology for Millimeter-Wave Photonic Systems on Si
A Capacitive Sensing Scheme for Control of Movable Element with Complementary Metal–Oxide–Semiconductor Microelectoromechanical-Systems Device
Conformal Coating of Organic Dielectric Film on Gold Electrodes in Microelectromechanical System Devices by Electrodeposition
The Influence of Stud Bumping above the MOSFETs on Device Reliability(Special Section on Reliability Theory and Its Applications)
Stress-Induced Device Degradation Due to Die-Attachment Process after Area Bump Formation
Stress-Induced Device Degradation Due to Die-Attach Process after Area Bump Formation
Ubiquitous User Authentication System with Wireless Battery-Powered Fingerprint Identification Module
Surface Cleaning of Gold Structure by Annealing during Fabrication of Microelectromechanical System Devices
Removal of Gold Oxide by Low-Temperature Hydrogen Annealing for Microelectromechanical System Device Fabrication
The Effect of Thick Interconnections Formed by Gold Electroplating on the Characteristics of Metal–Oxide–Semiconductor Field-Effect Transistors
Spin Coating Film Transfer and Hot-Pressing System for Uniform Dielectric Formation and Its Application to Porous Low-$k$ Film Formation
Electrodeposition of Water-Repellent Organic Dielectric Film as an Anti-Sticking Coating on Microelectromechanical System Devices
Peel-Off Characteristics at Interface between Base Film and Dielectrics with Spin-Coating Film Transfer and Hot-Pressing Technology
Monolithic Integration Fabrication Process of Thermoelectric and Vibrational Devices for Microelectromechanical System Power Generator

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