Machida Katsuyuki | NTT Telecommunications Energy Laboratories, 3-1 Morinosato-Wakamiya, Atsugi, Kanagawa 243-0198, Japan

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著作論文

Thick On-Chip Interconnections by Cu-Damascene Processes Using a Photosensitive Polymer
Characteristics of Fingerprint Sensing on Capacitive Fingerprint Sensor LSIs with a Grounded Wall Structure
Advanced Spin Coating Film Transfer and Hot-Pressing Process for Global Planarization with Dielectric-Material-Viscosity Control
Evaluation of Sensitivity on a Capacitive Fingerprint Sensor LSI with a Grounded Wall Structure
A New Fabrication Process for Low-Loss Millimeter-Wave Transmission Lines on Silicon
Fingerprint Identification System on a Single Chip Based on Advanced Circuit and Device Technologies
The Influence of Stud Bumping above the MOSFETs on Device Reliability(Special Section on Reliability Theory and Its Applications)
Characteristics of Fingerprint Sensing on Capacitive Fingerprint Sensor LSIs with a Grounded Wall Structure

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