SAKATA Tomomi | NTT Microsystem Integration Laboratories
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概要
関連著者
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SAKATA Tomomi
NTT Microsystem Integration Laboratories
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ISHII Hiromu
NTT Microsystem Integration Laboratories
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Sato Norio
Ntt Microsystem Integration Lab. Kanagawa Jpn
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KUDOU Kazuhisa
NTT Advanced Technology Corp.
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Kuwabara Kei
Ntt Microsystem Integration Laboratories Ntt Corporation
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MACHIDA Katsuyuki
NTT Microsystem Integration Laboratories
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MACHIDA Katsuyuki
NTT Advanced Technology Corporation
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SHIMAMURA Toshishige
NTT Microsystem Integration Laboratories
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KAMEI Toshikazu
NTT Advanced Technology Corp.
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Ishii Hiromu
Ntt Microsystem Integration Laboratories Ntt Corporation
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Yano Masaki
NTT Advanced Technology Corp.
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Machida Katsuyuki
NTT Advanced Technology Corp.
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Nagase Masao
Ntt Basic Research Laboratories
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Sato Norio
Ntt Corp. Kanagawa Jpn
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URANO Masami
NTT Microsystem Integration Laboratories
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YANO Masaki
NTT Advanced Technology Corporation, NTT Corporation
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OKABE Yuichi
NTT Microsystem Integration Labs.
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SATO Norio
NTT Microsystem Integration Labs.
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Yano Masaki
Ntt Advanced Technology Corporation
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Kudou Kazuhisa
Ntt Advanced Technology Corporation
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Machida K
Ntt Advanced Technology Corporation
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Kamei Toshikazu
Ntt Advanced Technology Corporation
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Kodate Junichi
Ntt Microsystem Integration Laboratories
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Ono Kazuyoshi
NTT Microsystem Integration Laboratories, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0198, Japan
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Okabe Yuichi
NTT Microsystem Integration Laboratories, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0198, Japan
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KUWABARA Kei
NTT Microsystem Integration Laboratories, NTT Corporation
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Shimoyama Nobuhiro
Ntt Microsystem Integration Laboratories
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SATO Yasuhiro
NTT Microsystem Integration Laboratories
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Sahri N
Ntt Microsystem Integration Laboratories Ntt Corporation
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町田 憲一
阪大先端セ
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Tazawa Hiroshi
Misuzu Industries Corporation
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CHINO Mitsuru
Misuzu Industries Corporation
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SHIMADA Teruo
Misuzu Industries Corporation
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Kodate Junichi
Ntt Microsystem Integration Laboratories Ntt Corporation
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MORIMURA Hiroki
NTT Microsystem Integration Laboratories
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Urano Masami
Ntt Microsystem Integration Laboratories Ntt Corporation
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JIN Yoshito
NTT Microsystem Integration Laboratories
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Shimoyama Nobuhiro
NTT Microsystem Integration Laboratories, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0198, Japan
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Takagahara Kazuhiko
NTT Microsystem Integration Laboratories, Atsugi, Kanagawa 243-0198, Japan
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Sato Norio
NTT Microsystem Integration Laboratories, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0198, Japan
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Machida Katsuyuki
NTT Advanced Technology Corporation, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0198, Japan
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Machida Katsuyuki
NTT Advanced Technology Corporation, Atsugi, Kanagawa 243-0124, Japan
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UCHIYAMA Shingo
NTT Microsystem Integration Laboratories
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Morimura Hiroki
Ntt Microsystem Integration Laboratories Ntt Corporation
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USUI Mitsuo
NTT Microsystem Integration Laboratories
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ISHII Hiromu
Head Office for "Tailor-Made and Baton-Zone" Graduate Course, Toyohashi University of Technology
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MATSUURA Tohru
NTT Microsystem Integration Laboratories
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SHIMOKAWA Fusao
Faculty of Engineering, Kagawa University
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Shimokawa Fusao
Faculty Of Engineering Kagawa University
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Terada Jun
Ntt Microsystem Integration Laboratories Ntt Corp.
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Ugajin Mamoru
Ntt Microsystem Integration Laboratories
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Ugajin Mamoru
NTT Microsystem Integration Laboratories, NTT Corporation, Atsugi, Kanagawa 243-0198, Japan
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Mutoh Shin'ichiro
NTT Microsystem Integration Laboratories, NTT Corporation, Atsugi, Kanagawa 243-0198, Japan
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Tazawa Hiroshi
Misuzu Industries Corporation, 1536 Nakaminowa, Minowa-machi, Kamiina-gun, Nagano 399-4601, Japan
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Kuwabara Kei
NTT Microsystem Integration Laboratories, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0198, Japan
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Kuwabara Kei
NTT Microsystem Integration Laboratories, NTT Corporation, Atsugi, Kanagawa 243-0198, Japan
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Yano Masaki
NTT Advanced Technology Corporation, Atsugi, Kanagawa 243-0124, Japan
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Sato Norio
NTT Microsystem Integration Laboratories, Atsugi, Kanagawa 243-0198, Japan
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Ishii Hiromu
NTT Microsystem Integration Labs.
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Ishii Hiromu
NTT Microsystem Integration Laboratories, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0198, Japan
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Ishii Hiromu
NTT Microsystem Integration Laboratories, NTT Corporation, Atsugi, Kanagawa 243-0198, Japan
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Ono Kazuyoshi
NTT Microsystem Integration Laboratories, NTT Corporation, Atsugi, Kanagawa 243-0198, Japan
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Shimamura Toshishige
NTT Microsystem Integration Laboratories, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0198, Japan
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Terada Jun
NTT Microsystem Integration Laboratories, NTT Corporation, Atsugi, Kanagawa 243-0198, Japan
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Morimura Hiroki
NTT Microsystem Integration Laboratories, NTT Corporation, Atsugi, Kanagawa 243-0198, Japan
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Shimamura Toshishige
NTT Microsystem Integration Laboratories, NTT Corporation, Atsugi, Kanagawa 243-0198, Japan
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Jin Yoshito
NTT Microsystem Integration Laboratories, NTT Corporation, Atsugi, Kanagawa 243-0198, Japan
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Jin Yoshito
NTT Microsystem Integration Laboratories, Atsugi, Kanagawa 243-0198, Japan
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NAGASE Masao
NTT Basic Research Labs.
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Shimada Teruo
Misuzu Industries Corporation, 1536 Nakaminowa, Minowa-machi, Kamiina-gun, Nagano 399-4601, Japan
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Sakata Tomomi
NTT Microsystem Integration Laboratories, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0198, Japan
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Sakata Tomomi
NTT Microsystem Integration Laboratories, Atsugi, Kanagawa 243-0198, Japan
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Nagase Masao
NTT Basic Research Laboratories, Atsugi, Kanagawa 243-0198, Japan
著作論文
- Novel Packaging Technology for Microelectromechanical-System Devices
- Selective Electrodeposition Technology for Organic Insulator Films on Microelectromechanical-System Structures
- Anti-Sticking Effect of Organic Dielectric Formed by Electrodeposition in Microelectromechanical-System Structures
- Novel Structure and Fabrication Process for Integrated RF Microelectromechanical-System Technology
- Electrodeposition of Organic Dielectric Film and Its Application to Vibrational Microelectromechanical System Devices
- Integrated RF-MEMS Technology with Wafer-Level Encapsulation
- Conformal Coating of Organic Dielectric Film on Gold Electrodes in Microelectromechanical System Devices by Electrodeposition
- Fabrication of a Microelectromechanical System Mirror Array and Its Drive Electrodes for Low Electrical Interference in Wavelength-Selective Switches
- Surface Cleaning of Gold Structure by Annealing during Fabrication of Microelectromechanical System Devices
- Removal of Gold Oxide by Low-Temperature Hydrogen Annealing for Microelectromechanical System Device Fabrication
- Selective Removal of Dry-Etching Residue Derived from Polymer Sacrificial Layer for Microelectromechanical-System Device Fabrication
- Removal of Gold Oxide by Low-Temperature Hydrogen Annealing for Microelectromechanical System Device Fabrication
- Synchronized Multiple-Array Vibrational Device for Microelectromechanical System Electrostatic Energy Harvester
- Novel Packaging Technology for Microelectromechanical-System Devices
- Electrodeposition of Water-Repellent Organic Dielectric Film as an Anti-Sticking Coating on Microelectromechanical System Devices
- Monolithic Integration Fabrication Process of Thermoelectric and Vibrational Devices for Microelectromechanical System Power Generator
- Electrodeposition of Organic Dielectric Film and Its Application to Vibrational Microelectromechanical System Devices