Characterization of Air-Gap Sealing with Organic Dielectric Using Spin-Coating Film Transfer and Hot-Pressing Technology

概要

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This paper describes a dielectric material and its application to sealing air gaps using spin-coating film transfer and hot-pressing (STP) technology. STP technology is a new film-formation process that consists of spin coating a dielectric material on a base film, hot pressing the dielectric film on a wafer with gaps in a vacuum chamber, and peeling the base film off the dielectric adhered to the wafer. In order to seal the gaps with thin dielectric films, it is necessary to prevent the dielectric from breaking during the peel-off step. Thus, a dielectric of poly(benzoxazole) (PBO) with additives for reducing the adhesion strength between the dielectric and the base film is proposed. The experimental results show that 0.3-μm-wide gaps can be sealed with dielectric films as thin as 0.25 μm without film breaking. The mechanism by which adhesion strength decreases in the peel-off step is discussed in terms of its dependence on the proportion of additives. The synergy of the STP process and the type of dielectric material used paves the way for the development of future interconnect schemes using air gaps.
2007-12-15