Peel-off characteristics at interface between base film and dielectrics with spin-coating film transfer and hot-pressing technology
スポンサーリンク
概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
著者
関連論文
- Selective Electrodeposition Technology for Organic Insulator Films on Microelectromechanical-System Structures
- The effect of thick interconnections formed by gold electroplating on the characteristics of metal-oxide-semiconductor field-effect transistors
- Thick Au High-Q Inductor and Its Chip-on-Chip Bonding on an RF IC for Various Frequencies
- RF-MEMS Switch Structure for Low-Voltage Actuation and High-Density Integration
- Characterization of air-gap sealing with organic dielectric using spin-coating film transfer and hot-pressing technology
- Peel-off characteristics at interface between base film and dielectrics with spin-coating film transfer and hot-pressing technology
- Novel Structure and Fabrication Process for Integrated RF Microelectromechanical-System Technology
- Electrodeposition of Organic Dielectric Film and Its Application to Vibrational Microelectromechanical System Devices
- Integrated RF-MEMS Technology with Wafer-Level Encapsulation
- Force-Sensing Scheme for Small Mechanical Signals in Complementary Metal Oxide Semiconductor Microelectromechanical System Fingerprint Sensor
- Thick-Dielectric Formation and MOSFET Reliability with Spin-Coating Film Transfer and Hot-Pressing Technique for Seamless Integration Technology
- Characteristics of Fingerprint Sensing on Capacitive Fingerprint Sensor LSIs with a Grounded Wall Structure
- Advanced Spin Coating Film Transfer and Hot-Pressing Process for Global Planarization with Dielectric-Material-Viscosity Control
- Evaluation of Sensitivity on a Capacitive Fingerprint Sensor LSI with a Grounded Wall Structure
- Application of 1.55-μm Photonic Technology to Practical Millimeter-Wave Network Analysis (Special Issue on Microwave and Millimeter Wave Technology)