Effect of Dispersant Addition during Ceria Abrasive Milling Process on Light Point Defect (LPD) Formation after Shallow Trench Isolation Chemical Mechanical Polishing (STI-CMP)

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概要

• 論文の詳細を見る
• Japan Society of Applied Physicsの論文
• 2005-02-10

著者

• Kang H‐g

  Nano-soi Process Laboratory Hanyang University

• Paik U

  Department Of Ceramic Engineering Hanyang University

• Paik Ungyu

  Department Of Ceramic Engineering Hanyang University

• Kim Dae-hyung

  Kctech

• Park J‐g

  Nano-soi Process Laboratory Hanyang University

• Kang Hyun‐goo

  Hanyang Univ. Seoul Kor

• Park Jea-gun

  Nano-SOI Process Laboratory, Hanyang University

• KANG Hyun-Goo

  Nano-SOI Process Laboratory, Hanyang University

• KATOH Takeo

  Nano-SOI Process Laboratory, Hanyang University

• Park Jea-gun

  Nano-soi Process Laboratory Hanyang University

• KIM Dae-Hyung

  Department of Ceramic Engineering, Hanyang University

• PAIK Ungyu

  K. C. Technol. Inc.

• Park Jea-gun

  Advanced Semiconductor Material And Device Development Center Hanyang University

• Kang Hyun-goo

  Nano-soi Process Laboratory Hanyang University

• Park Jea-gun

  Nano-soi Process Laboratory Department Of Electrical And Computer Engineering Hanyang University

• Katoh Takeo

  Nano-soi Process Laboratory Hanyang University

• Kim Dae-Hyung

  K. C. Technol. Inc., 268-1 Geruk-Ri, Miyang-Myon, Ansong-Shi, Kyonggi-Do, Korea

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• Extended Defects and Pile-Up of Interstitial Oxygen in Silicon Wafer Due to MeV-Level Nitrogen Ion Implantation

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