Kang Hyun‐goo | Hanyang Univ. Seoul Kor

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概要

• 同名の論文著者
• Hanyang Univ. Seoul Korの論文著者

関連著者

• Kang H‐g

  Nano-soi Process Laboratory Hanyang University

• Paik U

  Department Of Ceramic Engineering Hanyang University

• Paik Ungyu

  Department Of Ceramic Engineering Hanyang University

• Park J‐g

  Nano-soi Process Laboratory Hanyang University

• Kang Hyun‐goo

  Hanyang Univ. Seoul Kor

• Park Jea-gun

  Nano-SOI Process Laboratory, Hanyang University

• KANG Hyun-Goo

  Nano-SOI Process Laboratory, Hanyang University

• KATOH Takeo

  Nano-SOI Process Laboratory, Hanyang University

• Park Jea-gun

  Nano-soi Process Laboratory Hanyang University

• Park Jea-gun

  Advanced Semiconductor Material And Device Development Center Hanyang University

• Kang Hyun-goo

  Nano-soi Process Laboratory Hanyang University

• Park Jea-gun

  Nano-soi Process Laboratory Department Of Electrical And Computer Engineering Hanyang University

• Katoh Takeo

  Nano-soi Process Laboratory Hanyang University

• Park Hyung-soon

  Hynix Semiconductor Inc.

• Lee Won-mo

  Nano-soi Process Laboratory Hanyang University

• Kim Sung-jun

  Department Of Ceramic Engineering Hanyang University

• Kim S‐j

  Department Of Ceramic Engineering Hanyang University

• Kim S‐k

  Hanyang Univ. Seoul Kor

• Kim Dae-hyung

  Kctech

• Kim Sung-jun

  Nano-soi Process Laboratory Hanyang University

• KIM Dae-Hyung

  Department of Ceramic Engineering, Hanyang University

• PAIK Ungyu

  K. C. Technol. Inc.

• Kim Dae-Hyung

  K. C. Technol. Inc., 268-1 Geruk-Ri, Miyang-Myon, Ansong-Shi, Kyonggi-Do, Korea

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著作論文

• Effects of Abrasive Size and Surfactant Concentration on the Non-Prestonian Behavior of Ceria Slurry in Shallow Trench Isolation Chemical Mechanical Polishing
• Effects of Grain Size and Abrasive Size of Polycrystalline Nano-particle Ceria Slurry on Shallow Trench Isolation Chemical Mechanical Polishing
• Dependence of Nanotopography Impact on Abrasive Size and Surfactant Concentration in Ceria Slurry for Shallow Trench Isolation Chemical Mechanical Polishing
• Effect of Dispersant Addition during Ceria Abrasive Milling Process on Light Point Defect (LPD) Formation after Shallow Trench Isolation Chemical Mechanical Polishing (STI-CMP)

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