Park Hyung-soon | Hynix Semiconductor Inc.
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概要
関連著者
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Park Hyung-soon
Hynix Semiconductor Inc.
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Paik Ungyu
Department Of Ceramic Engineering Hanyang University
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Kang Hyun-goo
Nano-soi Process Laboratory Hanyang University
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Park Jea-gun
Nano-soi Process Laboratory Department Of Electrical And Computer Engineering Hanyang University
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Kang H‐g
Nano-soi Process Laboratory Hanyang University
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Paik U
Department Of Ceramic Engineering Hanyang University
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Park J‐g
Nano-soi Process Laboratory Hanyang University
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Park Jea-gun
Nano-SOI Process Laboratory, Hanyang University
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KANG Hyun-Goo
Nano-SOI Process Laboratory, Hanyang University
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Park Jea-gun
Advanced Semiconductor Material And Device Development Center Hanyang University
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Katoh Takeo
Nano-soi Process Laboratory Hanyang University
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KATOH Takeo
Nano-SOI Process Laboratory, Hanyang University
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Lee Myung-yoon
Nano-soi Process Laboratory Hanyang University
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Kang Hyun‐goo
Hanyang Univ. Seoul Kor
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Kim Sung-jun
Nano-soi Process Laboratory Hanyang University
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LEE Myung-Yoon
Nano-SOI Process Laboratory, Hanyang University
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PARK Hyung-Soon
Department of Ceramic Engineering, Hanyang University
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PAIK Ungyu
Hynix Semiconductor Inc.
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Park Jea-gun
Nano-soi Process Laboratory Hanyang University
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Kim Sung-jun
Department Of Ceramic Engineering Hanyang University
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Kim S‐j
Department Of Ceramic Engineering Hanyang University
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Kim S‐k
Hanyang Univ. Seoul Kor
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Park Jea-Gun
Nano-SOI Process Laboratory, Hanyang University, 17 Haengdang-Dong, Seoungdong-Gu, Seoul 133-791, Korea
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Lee Myung-Yoon
Nano-SOI Process Laboratory, Hanyang University, 17 Haengdang-Dong, Seoungdong-Gu, Seoul 133-791, Korea
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Park Hyung-Soon
Hynix Semiconductor Inc., San 136-1, Ami-ri, Bubal-eub, Icheon, Kyungki-do 467-701, Korea
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Kim Sung-Jun
Nano-SOI Process Laboratory, Hanyang University, 17 Haengdang-Dong, Seoungdong-Gu, Seoul 133-791, Korea
著作論文
- Dependence of pH, Molecular Weight, and Concentration of Surfactant in Ceria Slurry on Saturated Nitride Removal Rate in Shallow Trench Isolation Chemical Mechanical Polishing
- Effects of Abrasive Size and Surfactant Concentration on the Non-Prestonian Behavior of Ceria Slurry in Shallow Trench Isolation Chemical Mechanical Polishing
- Effect of Molecular Weight of Surfactant in Nano Ceria Slurry on Shallow Trench Isolation Chemical Mechanical Polishing (CMP)
- Effects of Grain Size and Abrasive Size of Polycrystalline Nano-particle Ceria Slurry on Shallow Trench Isolation Chemical Mechanical Polishing
- Dependence of pH, Molecular Weight, and Concentration of Surfactant in Ceria Slurry on Saturated Nitride Removal Rate in Shallow Trench Isolation Chemical Mechanical Polishing
- Effect of Molecular Weight of Surfactant in Nano Ceria Slurry on Shallow Trench Isolation Chemical Mechanical Polishing (CMP)
- Effects of Grain Size and Abrasive Size of Polycrystalline Nano-particle Ceria Slurry on Shallow Trench Isolation Chemical Mechanical Polishing