Dependence of pH, Molecular Weight, and Concentration of Surfactant in Ceria Slurry on Saturated Nitride Removal Rate in Shallow Trench Isolation Chemical Mechanical Polishing

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概要

• 論文の詳細を見る
• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2005-07-15

著者

• Kang H‐g

  Nano-soi Process Laboratory Hanyang University

• Paik U

  Department Of Ceramic Engineering Hanyang University

• Park J‐g

  Nano-soi Process Laboratory Hanyang University

• Park Jea-gun

  Nano-SOI Process Laboratory, Hanyang University

• Park Hyung-soon

  Hynix Semiconductor Inc.

• KANG Hyun-Goo

  Nano-SOI Process Laboratory, Hanyang University

• LEE Myung-Yoon

  Nano-SOI Process Laboratory, Hanyang University

• PARK Hyung-Soon

  Department of Ceramic Engineering, Hanyang University

• PAIK Ungyu

  Hynix Semiconductor Inc.

• Park Jea-gun

  Advanced Semiconductor Material And Device Development Center Hanyang University

• Lee Myung-yoon

  Nano-soi Process Laboratory Hanyang University

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