Reduction of Large Particles in Ceria Slurry by Aging and Selective Sedimentation and its Effect on Shallow Trench Isolation Chemical Mechanical Planarization

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概要

• 論文の詳細を見る
• 2006-09-15

著者

• KIM Sang-Kyun

  Department of Electronic Engineering, Inha University

• Kim S‐j

  Department Of Ceramic Engineering Hanyang University

• Kang H‐g

  Nano-soi Process Laboratory Hanyang University

• Paik U

  Department Of Ceramic Engineering Hanyang University

• Paik Ungyu

  Department Of Ceramic Engineering Hanyang University

• Kim S‐k

  Hanyang Univ. Seoul Kor

• Kim Dae-hyung

  Kctech

• Park J‐g

  Nano-soi Process Laboratory Hanyang University

• Park Jea-gun

  Nano-SOI Process Laboratory, Hanyang University

• KANG Hyun-Goo

  Nano-SOI Process Laboratory, Hanyang University

• KIM Dae-Hyeong

  KCTech

• Park Jea-gun

  Advanced Semiconductor Material And Device Development Center Hanyang University

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• Dependence of Nanotopography Impact on Abrasive Size and Surfactant Concentration in Ceria Slurry for Shallow Trench Isolation Chemical Mechanical Polishing
• Effects of Abrasive Morphology and Surfactant Concentration on Polishing Rate of Ceria Slurry
• Extended Defects and Pile-Up of Interstitial Oxygen in Silicon Wafer Due to MeV-Level Nitrogen Ion Implantation

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