Influence of Physical Characteristics of Ceria Particles on Polishing Rate of Chemical Mechanical Planarization for Shallow Trench Isolation

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概要

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• By considering the physical characteristics of ceria particles, the factors affecting the chemical mechanical planarization (CMP) performance for shallow trench isolation (STI) were investigated. Ceria powders were synthesized by calcination at temperatures of 400, 600, 700, 800, and 900°C. The influence of the calcination temperature on the physical characteristics, such as the crystallinity, grain size, porosity, morphology and high-resolution lattice images of the ceria particles, were investigated, and a correlation between the physical characteristics and the electrokinetic behaviors of the ceria particles in aqueous suspending media was also investigated to identify the relationship with CMP performance. Grain size increased with calcination temperature, as did the removal rate of plasma-enhanced tetraethylorthosilicate (PETEOS) film with slurries including these particles. The results indicate that the grain size of ceria particles is one of the key parameters controlling the removal rate and uniformity of PETEOS film.

• 2004-11-15

著者

• Paik Ungyu

  Department Of Ceramic Engineering Hanyang University

• Kim Sang-kyun

  Department Of Ceramic Engineering Hanyang University

• Yoon Phil-won

  Department Of Ceramic Engineering Hanyang University

• Park Jea-gun

  Nano-soi Process Laboratory Department Of Electrical And Computer Engineering Hanyang University

• Katoh Takeo

  Nano-soi Process Laboratory Hanyang University

• Yoon Phil-Won

  Department of Ceramic Engineering, Hanyang University, 17 Haengdang-Dong, Seoungdong-Gu, Seoul 133-791, Korea

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