Dependence of Nanotopography Impact on Abrasive Size and Surfactant Concentration in Ceria Slurry for Shallow Trench Isolation Chemical Mechanical Polishing
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概要
- 論文の詳細を見る
We used a blank chemical mechanical polishing (CMP) test to examine the dependence of nanotopography impact on surfactant concentration in three ceria slurries differing in abrasive size. We found that the magnitude of film thickness variation after CMP increased with the surfactant concentration in case of the smaller abrasives but for the case of larger abrasive was almost independent of the surfactant concentration. This result was explained with a model based on the passivation layer of the surfactant adsorbed on the oxide film surfaces during polishing.
- 2004-01-15
著者
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Lee Won-mo
Nano-soi Process Laboratory Hanyang University
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Paik Ungyu
Department Of Ceramic Engineering Hanyang University
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Kang Hyun-goo
Nano-soi Process Laboratory Hanyang University
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Park Jea-gun
Nano-soi Process Laboratory Department Of Electrical And Computer Engineering Hanyang University
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Katoh Takeo
Nano-soi Process Laboratory Hanyang University
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Lee Won-Mo
Nano-SOI Process Laboratory, Hanyang University, 17 Haengdang-Dong, Seoungdong-Gu, Seoul 133-791, Korea
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