Effects of Grain Size and Abrasive Size of Polycrystalline Nano-particle Ceria Slurry on Shallow Trench Isolation Chemical Mechanical Polishing
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概要
- 論文の詳細を見る
In a ceria slurry with an ionic surfactant, the grain size and particle size of the poly-crystalline abrasives were controlled independently by changing the calcination temperature and the mechanical milling time, respectively, during abrasive synthesis. A chemical mechanical polishing (CMP) experiment using the slurry showed that the oxide removal rate increased with both the grain size and the abrasive particle size, while the nitride removal rate was independent of both. On the other hand, examination of the nanotopography impact showed that the planarization efficiency increased with decreasing abrasive size but was independent of the grain size.
- 2004-03-01
著者
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Paik Ungyu
Department Of Ceramic Engineering Hanyang University
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Kim Sung-jun
Nano-soi Process Laboratory Hanyang University
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Park Hyung-soon
Hynix Semiconductor Inc.
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Kang Hyun-goo
Nano-soi Process Laboratory Hanyang University
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Park Jea-gun
Nano-soi Process Laboratory Department Of Electrical And Computer Engineering Hanyang University
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Katoh Takeo
Nano-soi Process Laboratory Hanyang University
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Park Jea-Gun
Nano-SOI Process Laboratory, Hanyang University, 17 Haengdang-Dong, Seoungdong-Gu, Seoul 133-791, Korea
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Park Hyung-Soon
Hynix Semiconductor Inc., San 136-1, Ami-ri, Bubal-eub, Icheon, Kyungki-do 467-701, Korea
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Kim Sung-Jun
Nano-SOI Process Laboratory, Hanyang University, 17 Haengdang-Dong, Seoungdong-Gu, Seoul 133-791, Korea
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