Influence of Physical Characteristics of Ceria Particles on Polishing Rate of Chemical Mechanical Planarization for Shallow Trench Isolation

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概要

• 論文の詳細を見る
• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2004-11-15

著者

• KIM Sang-Kyun

  Department of Electronic Engineering, Inha University

• Kim S‐j

  Department Of Ceramic Engineering Hanyang University

• Paik U

  Department Of Ceramic Engineering Hanyang University

• Paik Ungyu

  Department Of Ceramic Engineering Hanyang University

• Kim S‐k

  Hanyang Univ. Seoul Kor

• Park J‐g

  Nano-soi Process Laboratory Hanyang University

• Park Jea-gun

  Nano-SOI Process Laboratory, Hanyang University

• KATOH Takeo

  Nano-SOI Process Laboratory, Hanyang University

• YOON Phil-Won

  Department of Ceramic Engineering, Hanyang University

• Yoon Phil-won

  Department Of Ceramic Engineering Hanyang University

• Park Jea-gun

  Advanced Semiconductor Material And Device Development Center Hanyang University

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