Lee Won-mo | Nano-soi Process Laboratory Hanyang University

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概要

• 同名の論文著者
• Nano-soi Process Laboratory Hanyang Universityの論文著者

関連著者

• Lee Won-mo

  Nano-soi Process Laboratory Hanyang University

• Katoh Takeo

  Nano-soi Process Laboratory Hanyang University

• Paik U

  Department Of Ceramic Engineering Hanyang University

• Paik Ungyu

  Department Of Ceramic Engineering Hanyang University

• Park J‐g

  Nano-soi Process Laboratory Hanyang University

• Park Jea-gun

  Nano-SOI Process Laboratory, Hanyang University

• KATOH Takeo

  Nano-SOI Process Laboratory, Hanyang University

• Park Jea-gun

  Nano-soi Process Laboratory Hanyang University

• Park Jea-gun

  Advanced Semiconductor Material And Device Development Center Hanyang University

• Park Jea-gun

  Nano-soi Process Laboratory Department Of Electrical And Computer Engineering Hanyang University

• Jeon H

  Hanyang Univ. Seoul Kor

• JEON Hyeongtag

  Department of Materials Science and Engineering, Hanyang University

• Kang Hyun-goo

  Nano-soi Process Laboratory Hanyang University

• Kang H‐g

  Nano-soi Process Laboratory Hanyang University

• Kang Hyun‐goo

  Hanyang Univ. Seoul Kor

• KANG Hyun-Goo

  Nano-SOI Process Laboratory, Hanyang University

• KATOH Takeo

  Advanced Semiconductor Material and Device Development Center, Hanyang University

• PARKf Jea-Gun

  Advanced Semiconductor Material and Device Development Center, Hanyang University

• LEE Won-Mo

  Department of Materials Science and Engineering, Hanyang University

• PAIK Un-Gyu

  Department of Ceramic Engineering. Hanyang University

• SUGA Hisaaki

  Mitsubishi Materials Silicon Corporation

• Park Jea-gun

  Advanced Semiconductor Material & Device Development Center Hanyang University

• Lee Won-Mo

  Nano-SOI Process Laboratory, Hanyang University, 17 Haengdang-Dong, Seoungdong-Gu, Seoul 133-791, Korea

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著作論文

• Dependence of Nanotopography Impact on Abrasive Size and Surfactant Concentration in Ceria Slurry for Shallow Trench Isolation Chemical Mechanical Polishing
• Surfactant Effect on Oxide-to-Nitride Removal Selectivity of Nano-abrasive Ceria Slurry for Chemical Mechanical Polishing
• The Nanotopography Effect of Improved Single-Side-Polished Wafer on Oxide Chemical Mechanical Polishing : Semiconductors
• Dependence of Nanotopography Impact on Abrasive Size and Surfactant Concentration in Ceria Slurry for Shallow Trench Isolation Chemical Mechanical Polishing

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