Kim Dae-hyung | Kctech
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概要
関連著者
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Kang H‐g
Nano-soi Process Laboratory Hanyang University
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Kim Dae-hyung
Kctech
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Kim S‐j
Department Of Ceramic Engineering Hanyang University
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Paik U
Department Of Ceramic Engineering Hanyang University
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Paik Ungyu
Department Of Ceramic Engineering Hanyang University
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Kim S‐k
Hanyang Univ. Seoul Kor
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Park J‐g
Nano-soi Process Laboratory Hanyang University
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Park Jea-gun
Nano-SOI Process Laboratory, Hanyang University
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KANG Hyun-Goo
Nano-SOI Process Laboratory, Hanyang University
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Park Jea-gun
Advanced Semiconductor Material And Device Development Center Hanyang University
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KIM Sang-Kyun
Department of Electronic Engineering, Inha University
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KIM Dae-Hyeong
KCTech
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Kang Hyun‐goo
Hanyang Univ. Seoul Kor
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KATOH Takeo
Nano-SOI Process Laboratory, Hanyang University
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Park Jea-gun
Nano-soi Process Laboratory Hanyang University
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KIM Dae-Hyung
Department of Ceramic Engineering, Hanyang University
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PAIK Ungyu
K. C. Technol. Inc.
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Kang Hyun-goo
Nano-soi Process Laboratory Hanyang University
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Park Jea-gun
Nano-soi Process Laboratory Department Of Electrical And Computer Engineering Hanyang University
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Katoh Takeo
Nano-soi Process Laboratory Hanyang University
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Kim Dae-Hyung
K. C. Technol. Inc., 268-1 Geruk-Ri, Miyang-Myon, Ansong-Shi, Kyonggi-Do, Korea
著作論文
- Reduction of Large Particles in Ceria Slurry by Aging and Selective Sedimentation and its Effect on Shallow Trench Isolation Chemical Mechanical Planarization
- Effect of Calcination Process on Synthesis of Ceria Particles, and Its Influence on Shallow Trench Isolation Chemical Mechanical Planarization Performance
- Reduction of Large Particles in Ceria Slurry by Aging and Selective Sedimentation and its Effect on Shallow Trench Isolation Chemical Mechanical Planarization
- The Effect of Cerium Precursor Agglomeration on the Synthesis of Ceria Particles and Its Influence on Shallow Trench Isolation Chemical Mechanical Polishing Performance
- Agglomerated Large Particles under Various Slurry Preparation Conditions and Their Influence on Shallow Trench Isolation Chemical Mechanical Polishing
- Effect of Dispersant Addition during Ceria Abrasive Milling Process on Light Point Defect (LPD) Formation after Shallow Trench Isolation Chemical Mechanical Polishing (STI-CMP)