Lee Myung-yoon | Nano-soi Process Laboratory Hanyang University

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概要

• 同名の論文著者
• Nano-soi Process Laboratory Hanyang Universityの論文著者

関連著者

• Lee Myung-yoon

  Nano-soi Process Laboratory Hanyang University

• Park Hyung-soon

  Hynix Semiconductor Inc.

• Kang H‐g

  Nano-soi Process Laboratory Hanyang University

• Paik U

  Department Of Ceramic Engineering Hanyang University

• Park J‐g

  Nano-soi Process Laboratory Hanyang University

• Park Jea-gun

  Nano-SOI Process Laboratory, Hanyang University

• KANG Hyun-Goo

  Nano-SOI Process Laboratory, Hanyang University

• LEE Myung-Yoon

  Nano-SOI Process Laboratory, Hanyang University

• PARK Hyung-Soon

  Department of Ceramic Engineering, Hanyang University

• PAIK Ungyu

  Hynix Semiconductor Inc.

• Park Jea-gun

  Advanced Semiconductor Material And Device Development Center Hanyang University

• Kang Hyun-goo

  Nano-soi Process Laboratory Hanyang University

• Park Jea-gun

  Nano-soi Process Laboratory Department Of Electrical And Computer Engineering Hanyang University

• Paik Ungyu

  Department Of Ceramic Engineering Hanyang University

• KATOH Takeo

  Nano-SOI Process Laboratory, Hanyang University

• Katoh Takeo

  Nano-soi Process Laboratory Hanyang University

• Paik Ungyu

  Division of Advanced Materials Science Engineering, Hanyang University, Seoul 133-791, Korea

• Kanemoto Manabu

  Nano-SOI Process Laboratory, Hanyang University, 17 Haengdang-Dong, Seoungdong-Gu, Seoul 133-791, Korea

• Kanemoto Manabu

  Nano-SOI Process Laboratory, Hanyang University, Seoul 133-791, Korea

• Lee Myung-Yoon

  Nano-SOI Process Laboratory, Hanyang University, 17 Haengdang-Dong, Seoungdong-Gu, Seoul 133-791, Korea

• Lee Myung-Yoon

  Nano-SOI Process Laboratory, Hanyang University, Seoul 133-791, Korea

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著作論文

• Dependence of pH, Molecular Weight, and Concentration of Surfactant in Ceria Slurry on Saturated Nitride Removal Rate in Shallow Trench Isolation Chemical Mechanical Polishing
• Effect of Molecular Weight of Surfactant in Nano Ceria Slurry on Shallow Trench Isolation Chemical Mechanical Polishing (CMP)
• Effect of Alkaline Agent in Colloidal Silica Slurry for Polycrystalline Silicon Chemical Mechanical Polishing
• Effect of Molecular Weight of Surfactant in Nano Ceria Slurry on Shallow Trench Isolation Chemical Mechanical Polishing (CMP)

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