2409 ポリイミドの熱収縮を用いた3次元マイクロ機構の研究(J22-2 材料特性計測とマイクロ機構,J22 マイクロメカトロニクス,2005年度年次大会)

概要

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This paper describes three dimensional (3-D) micro mechanisms fabricated by a simple self-assembly process using thermal shrinkage of polyimide. The proposed method allows the hinged structure to be rotated out of the wafer plane automatically and to stay bent without special lock mechanisms. The hinged structures were fabricated by using surface micromachining techniques and heated in an oven. Increase in the bending angle due to shrinkage of polyimide was observed with increasing curing time, curing temperature, and length of the polyimide hinge. In these parameters, the curing time is found to be the most suitable for the precise control of bending angle. Furthermore, we have been fabricated a micro cube by this self-assembly process.
2005-09-18