Thermally Robust Nickel Silicide Process Technology for Nano-Scale CMOS Technology(Session B5 Si-Devices I)(2004 Asia-Pacific Workshop on Fundamentals and Application of Advanced Semiconductor Devices (AWAD 2004))

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概要

• 論文の詳細を見る

• A novel NiSi technology with bi-layer Co/TiN structure as a capping layer was proposed for the highly thermal immune Ni Silicide technology. Much better thermal immunity of Ni Silicide was certified up to 700 □, 30 min furnace annealing by introducing Co/TiN bi-layer capping. The proposed structure was successfully applied to the gate layers down to 80 nm and the sheet resistance showed little degradation even after the high temperature furnace annealing of 650 □, 30 min. The Ni/Co/TiN structure is very promising for the nano-scale MOSFET technology which needs the ultra shallow junction and high temperature post silicidation processes.

• 社団法人電子情報通信学会の論文
• 2004-06-24

著者

• Kim Yong

  Magnachip Semiconductor Inc.

• JI Hee-Hwan

  Magnachip Semiconductor Inc.

• LEE Heui-Seung

  Magnachip Semiconductor Inc.

• JI Hee-Hwan

  Dept. of Electronics Engineering, Chungnam National University

• WANG Jin-Suk

  Dept. of Electronics Engineering, Chungnam National University

• YUN Jang-Gn

  Dept. of Electronics Engineering, Chungnam National University

• OH Soon-Young

  Dept. of Electronics Engineering, Chungnam National University

• HUANG Bin-Feng

  Dept. of Electronics Engineering, Chungnam National University

• KIM Yong-Jin

  Dept. of Electronics Engineering, Chungnam National University

• KIM Ui-Sik

  Dept. of Materials Engineering, Korea University of Technology and Education

• CHA Han-Seob

  Dept. of Materials Engineering, Korea University of Technology and Education

• LEE Jeong-Gun

  Dept. of Materials Engineering, Korea University of Technology and Education

• Yun Jang‐gn

  Inter-university Semiconductor Research Center And School Of Electrical Engineering And Computer Sci

• Huang Bin

  Department Of Electronics Engineering Chungnam National University

• Lee H‐j

  Dept. Of Electronics Engineering Chungnam National University

• Lee Hi-deok

  R&d Division Lg Semicon Co. Ltd.

• Wang Jin

  Dept. Of Electronics Engineering Chungnam National University

• Wang Jin-suk

  Dept. Of Electronics Engineering Chungnam National University

• Kim Ui

  R&d Center Magnachip Semiconductor Ltd.

• Huh Sang

  R&d Center Magnachip Semiconductor Ltd.

• Cha Han

  R&d Center Magnachip Semiconductor Ltd.

• Kim Y‐c

  Magnachip Semiconductor Inc.

• Lee J‐g

  System Ic R & D Division Hynix Semiconductor Inc.

• Lee Jeong-gun

  R&d Center Lg Industrial Systems Co. Ltd.

• Lee H‐j

  Magnachip Semiconductor Inc.

• Kim Y‐j

  Magnachip Semiconductor Inc.

• Ji Hee

  Dept. Of Electronics Engineering Chungnam National University

• Kim Yong-jin

  Dept. Of Electronics Engineering Chungnam National University

• Yun Jang-Gu

  Dept. of Electronics Engineering, Chungnam National University

• Heo Sang-Bum

  Dept. of Electronics Engineering, Chungnam National University

• Ji Hee

  Magnachip Semiconductor Inc.

• Kim Yong-goo

  Electrical And Computer Engineering Chungnam National University

• Lee H‐d

  Chungnam National Univ. Taejon Kor

• Yun Jang

  Inter-university Semiconductor Research Center (isrc) And School Of Electrical Engineering And Compu

• Oh Soon

  Dept. Of Electronics Engineering Chungnam National University

• Yur Jang-gn

  School Of Electrical Engineering Seoul National University

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