Kim Yong-jin | Dept. Of Electronics Engineering Chungnam National University
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概要
関連著者
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KIM Yong-Jin
Dept. of Electronics Engineering, Chungnam National University
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Kim Yong-jin
Dept. Of Electronics Engineering Chungnam National University
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Kim Yong
Magnachip Semiconductor Inc.
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JI Hee-Hwan
Magnachip Semiconductor Inc.
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LEE Heui-Seung
Magnachip Semiconductor Inc.
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JI Hee-Hwan
Dept. of Electronics Engineering, Chungnam National University
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YUN Jang-Gn
Dept. of Electronics Engineering, Chungnam National University
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OH Soon-Young
Dept. of Electronics Engineering, Chungnam National University
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Yun Jang‐gn
Inter-university Semiconductor Research Center And School Of Electrical Engineering And Computer Sci
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Lee H‐j
Dept. Of Electronics Engineering Chungnam National University
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Lee Hi-deok
R&d Division Lg Semicon Co. Ltd.
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Huh Sang
R&d Center Magnachip Semiconductor Ltd.
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Cha Han
R&d Center Magnachip Semiconductor Ltd.
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Kim Y‐c
Magnachip Semiconductor Inc.
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Lee H‐j
Magnachip Semiconductor Inc.
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Kim Y‐j
Magnachip Semiconductor Inc.
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Ji Hee
Dept. Of Electronics Engineering Chungnam National University
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Ji Hee
Magnachip Semiconductor Inc.
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Kim Yong-goo
Electrical And Computer Engineering Chungnam National University
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Lee H‐d
Chungnam National Univ. Taejon Kor
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Yun Jang
Inter-university Semiconductor Research Center (isrc) And School Of Electrical Engineering And Compu
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Oh Soon
Dept. Of Electronics Engineering Chungnam National University
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Yur Jang-gn
School Of Electrical Engineering Seoul National University
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Lee Hi-Deok
Dept. of Electronics Engineering, Chungnam National University
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HUANG Bin-Feng
Dept. of Electronics Engineering, Chungnam National University
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Huang Bin
Department Of Electronics Engineering Chungnam National University
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Lee Hi-deok
Dept. Of Electronics Engineering Chungnam National Univ.
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Lee J‐g
System Ic R & D Division Hynix Semiconductor Inc.
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Lee Jeong-gun
R&d Center Lg Industrial Systems Co. Ltd.
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Kim Ui
R&d Center Magnachip Semiconductor Ltd.
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WANG Jin-Suk
Dept. of Electronics Engineering, Chungnam National University
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Wang Jin
Dept. Of Electronics Engineering Chungnam National University
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Wang Jin-suk
Dept. Of Electronics Engineering Chungnam National University
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HEO Sang-Bum
System IC R&D Division, Hynix Semiconductor Inc.
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LEE Jeong-Gun
System IC R&D Division, Hynix Semiconductor Inc.
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Yun Jang-Gu
Dept. of Electronics Engineering, Chungnam National University
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Lee Jeong-gun
System Ic R & D Division Hynix Semiconductor Inc.
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KIM Yong-Goo
Dept. of Electronics Engineering, Chungnam National University
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KIM Ui-Sik
Dept. of Materials Engineering, Korea University of Technology and Education
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CHA Han-Seob
Dept. of Materials Engineering, Korea University of Technology and Education
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LEE Jeong-Gun
Dept. of Materials Engineering, Korea University of Technology and Education
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Cho Yoo-jeong
Dept. Of Materials Engineering Korea University Of Technology And Education
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Kim Yeong-cheol
Dept. Of Materials Eng. Korea University Of Technology And Education
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Kim Yong-goo
Dept. Of Electrical And Electronic Eng. Yonsei Univ.
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CHA Han-Seob
System IC R & D Division, Hynix Semiconductor Inc.
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KIM Ui-Sik
System IC R&D Division, Hynix Semiconductor Inc.
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Heo Sang-Bum
Dept. of Electronics Engineering, Chungnam National University
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Park S‐h
Magnachip Semiconductor Inc.
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Park Seong-Hyung
Dept. of Electronics Engineering, Chungnam National University
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KIM Dae-Byung
Magnachip Semiconductor Inc.
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Joo Han-Soo
Dept. of Electronic Engineering, Chungnam National University
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KIM Yeong-Cheol
Dept. of Materials Engineering, Korea University of Technology and Education
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LEE Heui-Seung
Dept. of Materials Engineering, Korea University of Technology and Education
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KIM Dae-Byung
Dept. of Materials Engineering, Korea University of Technology and Education
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HU Sang-Bum
Dept. of Materials Engineering, Korea University of Technology and Education
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Park Sung-soo
Dept. Of Electronics Engineering Chungnam National University
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Lee Hi-deok
Dept. Of Electronics Engineering Chungnam National University
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Joo Han-soo
Dept. Of Electronics Engineering Chungnam National University
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Park Seong-hyun
Magnachip Semiconductor Inc.
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Agchbayar Tuya
Dept. Of Electronics Engineering Chungnam National University
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Lee Won-jae
Dept. Of Electronics Engineering Chungnam National University
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KIM Ui-Sik
R&D Center, MagnaChip Semiconductor Ltd.
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CHA Han-Seob
R&D Center, MagnaChip Semiconductor Ltd.
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HEO Sang-Bum
R&D Center, MagnaChip Semiconductor Ltd.
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HAN Kil-Jin
Dept. Of Materials Engineering, Korea University of Technology and Education
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KIM Yeong-Cheul
Dept. Of Materials Engineering, Korea University of Technology and Education
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CHA Han-Sub
System IC R&D Division, Hynix Semiconductor Inc.
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Han Kil-jin
Dept. Of Materials Engineering Korea University Of Technology And Education
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Park Seong-hyung
Lg Semicon. Ltd.
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WANG Tao
Dept. of Electronics Engineering, Chungnam National University
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SON Young-Hwan
Dept. of Electronics Engineering, Chungnam National University
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HAN In-Sik
Dept. of Electronics Engineering, Chungnam National University
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Han In-sik
Dept. Of Electronics Engineering Chungnam National University
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Son Young-hwan
Dept. Of Electronics Engineering Chungnam National University
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Park Seong-hyung
Dept. Of Electronics Engineering Chungnam National University
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Kim Dae-byung
Dept. Of Materials Engineering Korea University Of Technology And Education
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Park Si-ho
Chebigen Inc. 350-b. Chungmugwan Sejong University
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Wang Tao
Dept. Of Electronics Engineering Chungnam National University
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JOO Han-Soo
Dept. of Electronics Engineering, Chungnam National University
著作論文
- Low Temperature Formation of Highly Thermal Immune Ni Germanosilicide Using NiPt Alloy with Co Over-layer in Si_Ge_x according to Different Ge Fractions (x)
- Highly Thermal Immune Ni GermanoSilicide with Nitrogen-Doped Ni and Co/TiN Double Capping Layer for Nano-Scale CMOS Applications
- Novel Nitrogen doped Ni SALICIDE Process for Nano-Scale CMOS Technology
- Thermally Robust Nickel Silicide Process Technology for Nano-Scale CMOS Technology(Session B5 Si-Devices I)(2004 Asia-Pacific Workshop on Fundamentals and Application of Advanced Semiconductor Devices (AWAD 2004))
- Thermally Robust Nickel Silicide Process Technology for Nano-Scale CMOS Technology(Session B5 Si-Devices I)(2004 Asia-Pacific Workshop on Fundamentals and Application of Advanced Semiconductor Devices (AWAD 2004))
- Thermally Robust Nickel Silicide Process Technology for Nano-Scale CMOS Technology
- Study of Abnormal Oxidation of Ni-Germanosilicide by High Temperature Post-Silicidation Annealing(Session A3 Si Materails and Process)(2004 Asia-Pacific Workshop on Fundamentals and Application of Advanced Semiconductor Devices (AWAD 2004))
- Study of Abnormal Oxidation of Ni-Germanosilicide by High Temperature Post-Silicidation Annealing(Session A3 Si Materails and Process)(2004 Asia-Pacific Workshop on Fundamentals and Application of Advanced Semiconductor Devices (AWAD 2004))
- Theoretical Investigation of Neutral Point Defects in CoSi_2