K-0515 金属間化合物層を考慮した鉛フリーはんだの接続信頼性(S04-1 微視組織と変形・接続信頼性)(S04 金属材料の組織と疲労強度信頼性)

概要

論文の詳細を見る
In recent years there have been serious debates about the environmental problem where Pb should be removed from the solder joints. And the debates are now developing to a remarkable movement to establish regulations for theremoval of Pb, especially in European countries and Japan. Although the amount of Pb used in the electric and electronic devices small, it still have a possibility to resolve in the under-ground water and have a bad influence to human body if the printed circuit boards, abandoned as parts of the wasted electric and electronic components, are exposed to the rain. Therefore, many studies are aggressively promoted to develop technologies for replacing Sn-Pb solder by lead-free ones.
社団法人日本機械学会の論文
2001-08-22