P27 CAPを用いた電子デバイスBGAパッケージの簡易評価手法および熱疲労信頼性設計(疲労,ポスター講演3)

概要

論文の詳細を見る
With the miniaturization of an electron device, and high integration, a solder joint is made detailed and the heat fatigue reliability poses an important problem. Moreover, in case a design change of a package is made, grasp of the relation between each design parameter and reliability is demanded. So, in this research, the degree analysis of influence to the reliability of each design parameter was performed using the experimental design for the BGA package. Moreover, the correlation of each design parameter was clarified by using the clustering technique to the obtained result.
一般社団法人日本機械学会の論文
2005-11-03