均質化法による粒子分散形複合材料の特性評価

概要

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The homogenization method has been developed to evaluate effectively both homogenized material properties and microscopic stress/strain of composite materials. On the other hand, a particle dispersed composite is often used in many industrial field, such as molding resins for electronic packaging. The authors attempted to evaluate equivalent material properties of an elastic modulus and a thermal conductivity of the particle dispersed composite made of an epoxy resin including a silica, in order to estimate the microscopic stress/strain in the next stage. Moreover the validity of the numerical method will be assured with experimental measurements and theoretical rule of mixtures. The equivalent modulus and thermal conductivity are successfully evaluated using the finite element analysis by a framework of the homogenization theory at any volume fractions of filler.エポキシ樹脂に球状シリカ粉を封入した粒子分散形複合材料の等価弾性率および等価熱伝導率の評価を行った．複合則理論，均質化法および実験結果を比較することにより，その有効性を検討した．
2000-12-25