1112 電子デバイスBGAパッケージにおける信頼性の簡易評価に関する研究(J08-1 電子情報機器,電子デバイスの強度・信頼性評価と熱制御(1) はんだ接合部信頼性,ジョイントセッション,21世紀地球環境革命の機械工学:人・マイクロナノ・エネルギー・環境)

概要

論文の詳細を見る
This paper presents a design support methods to evaluate thermal fatigue life of solder balls on Ball Grid Array (BGA) package. Authors have investigated relations between the design factors and the reliability of soldered joints in BGA model by using clustering analysis. Based on relations between design factors and characteristic value, a function estimating inelastic strain range, which is the characteristic value for thermal fatigue life, was developed. The function can estimate the value to a set of design factors within 20% error.
2008-08-02